EPS Student Travel Awards
IEEE EPS is pleased to continue the Travel Awards Program for the annual Electronic Components and Technology Conference (ECTC) and in 2022 approved by the Board of Governors to extend the program for the Electronics System-Integration Technology Conference (ESTC) and the Electronics Packaging Technology Conference (EPTC).
The goals of these awards are to foster maximum student participation and to recognize students with superior conference papers. The Travel Awards are intended to assist students to attend the EPS flagship conferences.
All grants are available to apply towards actual travel expenses, including airfare, hotel, and meals. Grants will be awarded competitively based on abstracts submitted by student authors. The student who is named as the primary author of each winning abstract will receive a travel grant.
Costs that are directly tied to conference attendance are reimbursable up to the limits of $1300US for intracontinental travel and $2100US for intercontinental travel.
Eligibility: For all conferences, the competition is open to all full-time graduate students enrolled at an accredited institution in a program of study within the scope of ECTC, ESTC and EPTC. The student must be listed as the primary author on the abstract. A maximum of two authors (one per paper) from any one institution will receive a travel grant.
ECTC Student Travel Award
Description: The student travel grant program for ECTC awards up to 15 grants, at least 2 of which should be from historically underrepresented countries, at least 2 of which should be for students not residing in North America, and at least 3 of which should go to women.
ESTC Student Travel Award
Description: The student travel grant program for ESTC awards up to 6 grants, at least 2 of which should go to women and at least 1 of which should go to a student from a country historically underrepresented at that conference.
EPTC Student Travel Award
Description: The student travel grant program for EPTC awards up to 6 grants, at least 2 of which should go to women and at least 1 of which should go to a student from a country historically underrepresented at that conference.
Application Process: To apply, check the “IEEE EPS Travel Grant” box in the “Awards” section of the online abstract submission form.
ECTC Student Travel Grants
Krutikesh Sahoo, University of California, Los Angeles
Paper: “A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration”
Sung Hoon Lee, Georgia Institute of Technology
Paper: “Fully Portable Wireless Soft Stethoscope and Machine Learning for Continuous Real-Time Auscultation and Automated Disease Detection”
Atsushi Shinoda, Tohoku University
Paper: “Assembly-based Through-X-Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging”
Akari Watanabe, Kyoto Institute of Technology
Paper: “Cavity-resonator-integrated guided-mode-resonance mirrors for hybrid integration of wavelength-division-multiplexed light source”
Debabrata Mondal, Auburn University
Paper: “Modeling Grain Size Effects on Deformation Behavior of SAC Solder Joints”
Madison Manley, Georgia Institute of Technology
Paper: “Selective Cobalt Atomic Layer Deposition for Chip-to-Wafer 3D Heterogenous Integration”
Hafiz Waqas Ali, Université de Sherbrooke
Paper: “Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)”
Hussein Hamieh, Université de Sherbrooke
Paper: “1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications”
Dong Jun Kim, Korea Advanced Institute of Science and Technology (KAIST)
Paper: “Optimization of Cu interconnects - SiCN interfacial adhesion by surface treatments”
Golam Rakib Mazumder, Auburn University
Paper: “A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading”
Kankanige Udara Somarathna, Binghamton University
Paper: “The performance and reliability of flexible screen-printed multilayer conductive leads for wearable vital sign monitoring devices”
Michael Molter, University of Illinois Urbana-Champaign
Paper: “Thermal-aware SoC Macro Placement and Multi-chip Module (MCM) Package Design with Mixed-Variable Bayesian Optimization”
Varun Thukral, Delft University of Technology
Paper: “Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications”
Alexander Wilcher, University of Florida
Paper: “Surface Micromachined Integrable High Efficiency Ridge Gap Waveguide Bandpass Filter for G-Band 6G Applications”
Wei Chen, Fudan University
Paper: "Thermal-mechanical-electrical co-design of Fan-Out Panel-Level SiC MOSFET packaging with multi-objective optimization algorithm"