EPS ECTC Student Travel Awards

 

IEEE EPS is pleased to continue the ECTC Travel Awards Program for the annual Electronic Components and Technology Conference (ECTC). The goals of this award are to foster maximum student participation in the ECTC and to recognize students with superior ECTC papers.
Description: To promote student participation at the ECTC, EPS has supported travel to ECTC for 8 students. Grants are available to apply towards actual travel expenses,including airfare, hotel, and meals. Grants will be awarded competitively, based on abstracts submitted by student authors. The student who is named as the primary author of each winning abstract will receive a travel grant. 

Eligibility: The competition is open to all full-time graduate students enrolled at an accredited institution in a program of study within the scope of ECTC. The student must be listed as the primary author on the abstract. A maximum of two authors (one per paper) from any one institution will receive a travel grant. 

New promotion to Latin American Students

An expansion of the ECTC student travel award program in support 2 graduate-level students from under-represented geographies at the ECTC was approved by the Board of Governors. Up to 2 students with accepted ECTC papers from Latino-America, Region 9,  will be given travel a award.  This is the first step in promoting EPS growth in Latino-America. 

Application Process: To apply, check the “IEEE EPS Travel Grant” box in the “Awards” section of the online abstract submission form.

2018 Recipients

Luca Del Carro, ETH Zurich
Paper: “Laser sintering of dip-based all-copper interconnects”

Normand-Pierre Goodhue, Université de Sherbrooke
Paper: “Warpage Control during Mass Reflow Flip Chip Assembly using Temporary Adhesive Bonding”

Siva Chandra Jangam, University of California, Los Angeles
Paper: “Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon Interconnect Fabric”

Chenhui Li, Eindhoven University of Technology
Papr: “400 Gbps 2-Dimensional Optical Receiver Assembled on Wet Etched Silicon Interposer”

Tong-Hong Lin, Georgia Institute of Technology
Paper: “Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and Modules for Broadband 5G Applications”

Nivesh Mangal, Ghent University
Paper: “Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling”

Saikat Mondal, Michigan State University
Paper: “A Harmonic RF Phase-Shifter based Wireless pH Sensor”

Bo Song, Georgia Institute of Technology
Paper: “Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas”

2017 Recipients
Jiawei Marvin Chan, Nanyang Technological University
Paper: “Reliability Evaluation of Copper (Cu) Through-Silicon Via (TSV) Barrier and Dielectric Liner by Electrical Characterization and Physical Failure Analysis (PFA)”

Luca Del Carro, ETH Zurich
Paper: “Morphology study of bimodal-particle-based all-copper interconnects formed at low sintering temperature”

Alexander Hanss, Technische Hochschule Ingolstadt
Paper: “New Method to Separate Failure Modes by Transient Thermal Analysis of High Power LEDs”

Chenhui Li, Eindhoven University of Technology
Paper: “3D Packaging of Embeded Opto-electronic Die and CMOS IC Based on Wet Etched Silicon Interposer”

Junjie Li, Huazhong University of Science and Technology
Paper: “Low-temperature and low-pressure Cu-Cu bonding by pure Cu nanosolder paste for wafer-level packaging”

Muhammad Amin Saleem, Smoltek AB
Paper: “On-Chip solid-state micro-supercapacitor”

Ninad Shahane, Georgia Institute of Technology
Paper: “Enabling chip-to-package Cu-Cu interconnections: design of engineered bonding interfaces for improved manufacturability and low-temperature bonding”

Divya Taneja, CEA-LETI
Paper: “Cu-SnAg interconnects evaluation for the assembly at 10µm and 5 µm pitch”

2016 Recipients
Manuela Loeblein, Nanyang Technological University
Paper: “ Heat Dissipation Enhancement of 2.5D Package with 3D Graphene & 3D Boron Nitride Networks as Thermal Interface Material (TIM)”

Akira Yamauchi, Keio University
Paper: “Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration”

Yan Yang, IME 
Paper: “3D Silicon Photonics Packaging Based on TSV Interposer for High Density On-Board Optics Module”

Jonas Zürcher, Swiss Federal Institute of Technology     
Paper: “All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering”

Chenhui Li, Eindhoven University of Technology
Paper: “ Wet Etched Silicon Interposer for the 2.5D Stacking of CMOS and Optoelectronic Dies”

Connor Howe, Virginia Commonwealth University
Paper: “ An Implantable, Stretchable Microflow Sensor Integrated with a Thin-Film Nitinol Stent”

Jen-Jui Yu, National Taiwan University  
Paper: “Choice of Intermetallics for Structural Applications in Micro Joints of Three-Dimensional Integrated Circuits (3D ICs)”

Bruce Chou, Packaging Research Center at Georgia Tech
Paper: “ Design and Demonstration of Micro-Mirror and Lens for Low-loss and Low-Cost Single-Mode Fiber Coupling in 3D Glass Photonic Interposers”


2015 Recipients
Sarkis Babikian, University of California, Irvine
Paper: “Integrated Bioflexible Electronic Device for Electrochemical Analysis of Blood”

Ossama El Bouayadi, CEA-LETI
Paper: “Silicon Interposer: A Versatile Platform Towards Full-3D Integration of Wireless Systems at Millimeter-Wave Frequencies

Masaki Ohyama, Waseda University
Paper:” Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single-Micron Pitch

Yu-Cheng Hsieh, National Chiao Tung University
Paper:” Development and Electrical Investigation of Novel Fine-Pitch Cu/Sn Pad Bumping Using Ultra-Thin Buffer Layer Technique in 3D Integration

Jonas Zürcher, IBM Research - Zurich
Paper: “Nanoparticle Assembly and Sintering Towards All-Copper Flip Chip Interconnects

Bo Song, Georgia Institute of Technology
Paper: “Flexible Solid-State Micro-Supercapacitors for On-Chip Energy Storage Devices

Xiao Hu, City University of Hong Kong
Paper: “Novel WO3 Nanoparticles Modified Electroless Metallization to Retard Interfacial Reaction and Reinforce the Reliability of Solder Interconnection

Aliaksei Klyshko, University of Rome la Sapienza
Paper: “Oxidized porous silicon: the route to low-cost, low loss and high performance 3D tapered coupler for silicon photonics circuits and MCM optical backplane”

2014 Recipients
William  Krieger, Georgia Institute of Technology
Paper: “A Cohesive Zone Method for Prediction of Interfacial Failure In Microelectronic Systems”

Taoran  Le, Georgia Institute of Technology
Paper: “Enhanced-Performance Wireless Conformal "Smart Skins" Utilizing Inkjet-Printed Porous Carbon-Nanostructures”

Yu Ji, Southeast University
Paper: “Preparation of a Micro Rubidium Vapor Cell and Its Integration in a Chip-Scale Atomic Magnetometer”

Hideto Hashiguchi, Tohoku University    
Paper: “Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly”

Yuka Ito, Tohoku University      
Paper: “Direct Multichip-to-Wafer 3D Integration Technology Using Flip-Chip Self-Assembly of NCF-Covered Known Good Dies”

Cui Huang, Tsinghua University
Paper: “Thermal and Electrical Tests of Air-Gap TSV”

Xu Chen, University of Illinois, Urbana-Champaign         
Paper: “Optimal Relaxation of I/O Electrical Requirements under Packaging Uncertainty by Stochastic Methods”

Tengfei Jiang, University of Texas, Austin          
Paper: “Effect of High Temperature Storage on the Stress and Reliability of 3D Stacked Chips”