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- Selected Nanotechnology Advances in Interconnections, Power, RF and Sensor Integration at ECTC 2022
- Top T-CPMT Papers on Xplore
- Additively Manufactured Highly Integrated mm-Wave Packaging Structures
- Universal Chiplet Interconnect Express (UCIe)®: An open standard for developing a successful chiplet ecosystem
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- May 2022
- ECTC 2022: EPS Technical Committee Meetings
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- The Bunch of Wires (BoW) – An Open-Source Physical Interface Enabling Chiplet Architectures
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- Challenges and Advances in Electric Propulsion Motor Thermal Management for Aircraft
- April 2022
- Top T-CPMT Papers on Xplore
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- Emerging Technology; Smart Manufacturing of Computer Systems and Assemblies
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- Chiplet Technology and Heterogeneous Integration
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- March 2022
- Bridge-chip Interconnect Technologies
- Top T-CPMT Papers on Xplore
- Call for References to Support Senior Member Applications
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- ECTC 2022 Special Session: Interconnect Technologies for Chiplets
- Road to Chiplets: Heterogeneous Integration Testability
- January 2022
- Top T-CPMT Papers on Xplore
- EPS Awards Nomination Period Closes January 26, 2022
- Nominations for EPS Distinguished Certificates Now Open
- It’s Time To Renew Your IEEE Electronics Packaging Society (EPS) Membership!
- Greetings from the EPS President
- 2022 ESTC Call For Papers, Sponsors & Exhibitors
- 2022 IEMT Call For Papers
- Webinar: To Chiplet or Not To Chiplet: Heterogeneous Integration and Chiplets
- December 2021
- Congratulations Newly Elevated EPS Senior Members and Fellows
- EPS Awards Nomination Period Remains Open Until January 26, 2022
- Top T-CPMT Papers on Xplore
- SPI 2022 Call For Papers
- EPS Chapter Awarded 2021 Region 6 Outstanding Chapter of the Year
- Verifying Results of Quantum Circuit Compilation Flows
- 3D Integration Technologies for Various Quantum Computing Devices
- Maximizing Benefits of Adaptive Test Techniques by Integration of ML and Test Infrastructure Improvements
- EPS Distinguished Certificates
- November 2021
- The Role of Packaging for Sustainable and Green Electronics
- ESTC 2022 Call for Papers
- Tethered Power Systems for Lunar Mobility and Power Transmission
- Congratulations to the Newly Elected EPS Members at Large
- IEEE Women In Engineering Competition
- Top T-CPMT Papers on Xplore
- EPTC 2021 2nd Call For Registration
- Flexible Electronics Masterclass #10
- Upcoming EPS Malaysia Webinar
- October 2021
- The First IEEE EPS Student Branch Chapter in Africa
- Online Seminar: Reliability of Electronic Systems Nov. 17-18, 2021
- Voting Still Open for EPS Members At Large
- EPS Awards Nomination Period Open Until January 26, 2022
- Upcoming IEEE EPS France Webinar
- Top T-CPMT Papers on Xplore
- International Electronics Week in Central and South-Eastern Europe – Second Edition
- IEEE Educational Activities Newsletter
- ESTC 2022 Call for Papers
- Symposium on Reliability for Electronics and Photonics Packaging
- What’s Driving Substrate Shortages?
- 30 Years of Promoting Electronic Packaging PCB Education and Training Topics In Romania
- September 2021
- Be a Speaker at the 72nd ECTC in San Diego
- Call for Abstracts - Symposium on Reliability for Electronics and Photonics Packaging
- EPS Distinguished Certificates
- SCV EPS Chapter Barbeque
- Voting Now Open for EPS Members At Large until Oct. 19, 2021
- EPS Awards Nomination Period Now Open Until January 26, 2022
- Upcoming Emerging Technologies TC Webinar
- Top T-CPMT Papers on Xplore
- Co-design and Co-analysis of 3D Integrated Electronics
- EPTC 2021 Call For Registration
- ITHERM 2022
- August 2021
- Semiconductor Test Thermal Management
- 3D Die-to-Die Interconnect Testing Challenges and the Need for an IEEE Standard
- Call for Nominations: Avram Bar-Cohen Memorial Award - 2021
- Binghamton University's 32nd Electronics Packaging Symposium
- IEEE EPS Swiss Webinar
- Upcoming Emerging Technologies TC Webinar
- Top T-CPMT Papers on Xplore
- Call for Papers - 10th IEEE CPMT Symposium Japan (ICSJ2021)
- State-of-the-Art Packaging, Interconnects and AiP Modules for Millimeter-Wave 5G+ Applications
- Call for Abstracts: Symposium on Reliability for Electronics and Photonics Packaging
- July 2021
- Second Annual REPP - Call for Abstracts
- IEEE 3DIC 2021 - Call For Papers
- The First IEEE Student Branch in Ethiopia
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- Malaysia EPS Webinar Series 2021
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- June 2021
- Upcoming EPS Malaysia Webinar
- Chiplets
- Nomination Period Extended for EPS Members at Large
- IEEE Senior Membership: Are You In?
- EPS Certificate Program Expanded
- 5G HVM Test Challenges – From RF to mmWave application
- IEEE Malaysia Section Newsletter IEEE Electronic Packaging Society
- Top T-CPMT Papers on Xplore
- May 2021
- Nomination Period Now Open for EPS Members at Large
- Newly Formed EPS Dallas Chapter
- IEEE COMCAS 2021
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