IEEE Electronics Packaging Society - IEEE Electronics Packaging Society

Fan Bio

Fan Photo

XUEJUN FAN (M:  2002, SM: 2006) is currently a professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. Over 25 years he has made many significant and distinguished contributions and outstanding achievements in several important fields encompassed by the IEEE EP Society. He is a well-known and internationally recognized expert in thermal and thermo-mechanical reliability, modeling and characterization of electronic materials, IC packaging and reliability, and LED packaging and system integration. He received the Outstanding Sustained Technical Contribution Award in 2017 and the Exceptional Technical Achievement Award in 2011. His papers received the Best Paper Award in IEEE Transactions on Components and Packaging and Technology in 2017 and 2008, respectively.

Dr. Fan received his PhD from Tsinghua University, Beijing, China in 1989. He became a full professor in 1991, at the age of 27, at Taiyuan University of Technology (TUT), China. He was one of the youngest professors in China at that time. Dr. Fan served as Associate Department Chair (1990-1993) and the Director of Institute of Applied Mechanics (1994-1997) at TUT. He was Visiting Professors at the University of Tokyo, Japan (1993-1994), and the University of British Columbia, Canada (1996-1997), respectively. He became a Member of Tech Staff and Group Leader at the Institute of Microelectronics (IME), Singapore (1997-2000), and then, Senior Member of Research Staff at Philips Research, Briarcliff Manor, New York (2001-2004), and Senior Staff Engineer at Intel Corporation (2004 – 2007), and a professor at Lamar University (2007 - present).

 

Dr. Fan has published more than 220 papers, including over three books, 25 book chapters, and over 100 journal papers, and several patents. His publication h-index is 24. His first co-authored book “Mechanics of Microelectronics” has been adopted by some universities as textbooks. His book “Moisture Sensitivity of Plastic Packages of IC Devices’ has been downloaded over 5000 times since its publication in 2011. His book on “Solid State Lighting Reliability: Components to System”, has been downloaded over 40,000 times since its publication in 2012. Dr. Fan is a key contributing member for several white papers on solid state lighting reliability released by the Department of Energy (DOE), and a contributing member for a new JEDEC standard: JESD22-B111A: Board Level Drop Test Method of Components for Handheld Electronic Products, which is released in November 2016. Dr. Fan also serves as Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.

Dr. Fan has been very actively leading and participating in many IEEE/CPMT activities in last 15 years. He has served General Co-Chair (2012 – present), Program Chair (2010), and Technical Chair/Co-Chair (2005 – 2010) for ICEPT since 2005. Dr. Fan has been serving ECTC technical committee since 2003, and attends ECTC planning meeting in Dallas and ECTC conference every year. Dr. Fan has been one of the founding members for EuroSimE, which has become one of the specialized CPMT conference in modeling, simulation and characterization in heterogeneous system. Dr. Fan also serves as program /technical/ advisory committee members for EPTC, ESTC, IRPS, IEMT, EMPC, etc. Dr. Fan has been an ECTC PDC instructor since 2005. As IEEE Distinguished Lecturer, he has given numerous keynotes and tutorials around world each year on behalf of CPMT society. He has become a key liaison between CPMT BoG and ICEPT Executive Committee, in which he has developed the fruitful partnership between CPMT society and China Electronics Packaging Technology Society. He is currently serving as co-Chair for Modeling/Co-Design in Heterogeneous Integration Roadmap Committee.