photo b chen

WILLIAM CHEN 

Fellow of ASE Group
Sunnyvale, California, USA 

“For contributions to electronic packaging from research and development through industrialization, and for his leadership in strategic roadmapping efforts.”

The prestigious award will be presented to Dr. Chen at the 68th ECTC in San Diego, CA 

The multi-billion dollar microelectronics industry is fundamentally dependent on the manufacture of semiconductor integrated circuits.  IEEE Transactions on Semiconductor Manufacturing (TSM) is devoted to exploring all issues related to high-volume integrated circuit (IC) production, including cost, cycle time, equipment utilization, yield, operations management, automation, and environmental impact.  As a result, this journal plays a critical role in serving the IC industry through the dissemination of information which provides solutions and approaches to optimizing these variables.

Nov 20, 2017 - Nov 22, 2017
Brest, France
Abstract Submission Date: Jan 19, 2018
May 22, 2018 - May 25, 2018
Dresden, Germany
Abstract Submission Date: Jan 31, 2018
Sep 18, 2018 - Sep 21, 2018
Albuquerque, NM USA
Abstract Submission Date: Feb 5, 2018
Oct 14, 2018 - Oct 18, 2018

The UCLA Center for Heterogeneous Integration and Performance Scaling is pleased to announce the 2nd UCLA CHIPS Workshop held at the UCLA Campus on Wednesday, November 1, 2017. Please Read More to view the full agenda.