ECTC 2018 and ITherm 2018 co-locating May 29-June 1, 2018 San Diego, CA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
The 2018 ECTC includes:
· 41 technical sessions covering all aspects of advanced packaging:
o 36 technical sessions covering wafer-level and fan-out packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies
o 4 Interactive Presentation sessions
o 1 Student Interactive Presentation session
· 18 CEU-approved Professional Development Courses
· More than 100 Technology Corner Exhibits featuring industry-leading vendors
ITherm is co-locating with ECTC this year. ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.
NextFlex Community FHE Requirements for Medical, Health & Wearables
In support of the IEEE Heterogenous Integration Roadmap, Jason Marsh, Director of Technology at NextFlex, recently spoke on behalf of the NextFlex community led by Mark Poliks of Binghamton University and Nancy Stoffel of GE Global Research. NextFlex was pleased to participate given the broad industry support for roadmap activities, and noted that support for the Medical, Health and Wearables TWG has increased significantly. Roadmapping is core to NextFlex’s DNA, having ramped up multiple roadmapping activities over the past two years. Establishing a roadmap that is shared by industry leaders to help guide investment and development to advance manufacturing capabilities to extend beyond Moore’s law is critical to the development of wearable and implantable medical devices, as well as for delivering on the promise of the Internet of Things.
Most Popular T-CPMT Papers
Most accessed documents for the month of February 2018
3-D Printed Metal-Pipe Rectangular Waveguides
Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn
Publication Year: 2015, Page(s):1339 - 1349
Manufacturing Considerations in the 3-D Printing of Fractal Antennas
Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland
Publication Year: 2017, Page(s):1891 - 1898
Packaging Solution for a Millimeter-Wave System-on-Chip Radar
Benjamin Goettel ; Wolfgang Winkler ; Akanksha Bhutani ; Florian Boes ; Mario Pauli ; Thomas Zwick
Publication Year: 2018, Page(s):73 - 81
EMPC 2019 Early Announcement
European Microelectronics and Packaging Conference
September 16 - 19, 2019 Pisa, Italy
www.empc2019.org
Added Membership Benefit
As an IEEE EPS member, you have access to several benefits that we provide exclusively for our society members, including:
· Free Subscription to IEEE DataPort (https://ieee-dataport.org): I