Apr 30, 2018 - May 3, 2018
May 22, 2018 - May 25, 2018

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Milpitas, CA USA
Abstract Submission Date: Jun 15, 2018
Sep 13, 2018 - Sep 14, 2018
Oct 24, 2018 - Oct 26, 2018
Kyoto, Japan
Abstract Submission Date: May 25, 2018
Nov 19, 2018 - Nov 21, 2018

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Most accessed T-CPMT articles for the month of March 2018

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn


Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Benjamin Goettel ; Wolfgang Winkler ; Akanksha Bhutani ; Florian Boes ; Mario Pauli ; Thomas Zwick


Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland


Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications

Richa Chandel ; Anil Kumar Gautam ; Karumudi Rambabu

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A notification will be sent to all EPS members

Election Principles                                                                                                                                                                                         

The EPS Board of Governors (BoG) includes 18 Members-at-Large, elected by the full voting membership of the Society. The three-year terms of the Members-at-Large are staggered, so that six Members-at-Large to the Board of Governors are elected annually.

Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large plus continuing Members-at-Large has the proper proportion of representatives from each Region/grouping of Regions.

Each Region/grouping of Regions will have a separate slate of candidates from that Region.  Voting members will elect members-at-large from within their Region only (that is, members in Region 8 vote for Members-at-Large from Region 8, members in Region 10 vote for Members-at-Large from Region 10; etc.).

Eligibility                                                                                                                                                                                            

Candidates for Member-at-Large must:                  

     - be a current member of both IEEE and EPS

    - be willing to attend two annual Board meetings

     - be willing to participate actively in areas of their interest (publications, conferences, membership development, chapter development, etc).

 

May 29-June 1, 2018 San Diego, CA

The Sheraton Hotel & Marina

San Diego, CA

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.  

ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series. 

ECTC/ITherm Co Sponsored Events:

Young Professionals Panel & Reception

Tuesday, May 29, 2018, 7:00 - 7:45 p.m.

The two panelists will talk about career development for young professionals based on their experiences and achievements in the industry and academia. A reception for panelists and attendees will follow.

1.     Steve Bezuk – Qualcomm Technologies, Inc.

2.     Kathleen Kramer – University of San Diego

 

Women's Panel and Reception Women's Panel and Reception 

Wednesday, May 30, 2018, 6:30 - 7:30 p.m.

Chairs: Cristina Amon - University of Toronto and Tanja Braun - Fraunhofer Institute for Reliability and Microintegration (IZM)