HIR: Test Technical Working Group
The Test Roadmap Working Group is composed of 145 experts coming from 55 companies world-wide. This size of a team is appropriate given the complexity of the test in the Semiconductor industry. Not only do we have responsibility for determining good parts from bad, we also play a commanding role in tracking process parameters, product yields, and product reliability. Additionally, changes in test are nearly continuous as we strive to keep ahead of the latest industry challenges such as continuing Moore’s law growth which is being compounded by heterogeneous integration techniques, 5G mobile phone components, photonic interfaces, and requirements for data sharing which conflict strongly with security and proprietary data concerns.
Read MoreNext EPS Board of Governors Meeting June 2, 2018
The next EPS Board of Governors (BoG) meeting will be held June 2, 2018 in conjunction with ECTC and ITherm.
All Members are welcome to attend. The Board members will be discussing, among other things, the strategic direction of the Society as well as the latest projects and events the Society is working on.
Date: Saturday June 2, 2018
Time: 8:00 AM - 5:00 PM
Location: Sheraton San Diego Hotel & Marina
Room: Seabreeze
Upcoming Conferences
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May 22, 2018 - May 25, 2018
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May 22, 2018 - May 25, 2018
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San Diego, CA USA
May 29, 2018 - Jun 1, 2018
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San Diego, CA USA
May 29, 2018 - Jun 1, 2018
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Jun 12, 2018 - Jun 14, 2018
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Call For Papers
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Milpitas, CA USA
Abstract Submission Date: Jun 15, 2018
Sep 13, 2018 - Sep 14, 2018
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Taipei, Taiwan
Abstract Submission Date: Jun 15, 2018
Oct 24, 2018 - Oct 26, 2018
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Nov 19, 2018 - Nov 21, 2018
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Chandigarh, India
Abstract Submission Date: Jul 22, 2018
Dec 16, 2018 - Dec 18, 2018
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Hong Kong
Abstract Submission Date: Jul 31, 2018
Dec 17, 2018 - Dec 20, 2018
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Toulouse, France
Abstract Submission Date: Nov 17, 2018
Apr 24, 2019 - Apr 26, 2019
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Most Popular T-CPMT Papers
Most accessed documents for the month of April 2018
3-D Printed Metal-Pipe Rectangular Waveguides
Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn
Publication Year: 2015, Page(s):1339 - 1349
Packaging Solution for a Millimeter-Wave System-on-Chip Radar
Benjamin Goettel ; Wolfgang Winkler ; Akanksha Bhutani ; Florian Boes ; Mario Pauli ; Thomas Zwick
Publication Year: 2018, Page(s):73 - 81
Manufacturing Considerations in the 3-D Printing of Fractal Antennas
Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland
Publication Year: 2017, Page(s):1891 - 1898