August 2018 - IEEE Electronics Packaging Society

Description/Objective:

To promote student participation at the ECTC, EPS has travel to ECTC for 8 students.

Prize:

A certificate and reimbursable travel expenses up to the limits of $1,300 US for students at US institutions and $2,100 US for students at non-US institutions.

Eligibility:

Twenty candidates are preliminary selected based on the ECTC technical committee scoring and a balance among the various committees. The student paper must be accepted to be presented at the conference, and the student must be the presenter and the paper first author. The candidates are requested to submit an extended abstract. A committed of up to 5 evaluators then rate the extended abstracts and the top 8 are selected for the travel award.

New promotion to Latin American Students

An expansion of the ECTC student travel award program in support 2 graduate-level students from under-represented geographies at the ECTC was approved by the Board of Governors. Up to 2 students with accepted ECTC papers from Latino-America, Region 9, will be given travel a award. This is the first step in promoting EPS growth in Latino-America.

ESTC 2018 has several Special Workshops scheduled for Wednesday afternoon, September 19th.

Hot topics in the field of electronic packaging are presented and discussed. Share your experiences and opinions with colleagues.

Access to those Special Workshops is included in the conference fee.

5 Most Popular Articles according to July 2018 Xplore® usage statistics

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349

A Low-Cost and High-Gain 60-GHz Differential Phased Array Antenna in PCB Process

Tao Zhang ; Lianming Li ; Haiyang Xia ; Xujun Ma ; Tie Jun Cui

Publication Year: 2018, Page(s):1281 – 1291

Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland

Publication Year: 2017, Page(s):1891 – 1898

A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Hui Chu ; Yong-Xin Guo

Publication Year: 2017, Page(s):964 – 973

Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ;Ray T. Chen

Publication Year: 2018, Page(s):1 – 7

The 2019 IEEE 69th Electronic Components and Technology Conference
The premier international packaging, components, and
microelectronics systems technology conference

You are invited to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following:

· Applied Reliability

· Assembly and Manufacturing Technology

· Emerging Technologies

· High Speed, Wireless and Components

· Interconnections

· Materials & Processing

· Thermal/Mechanical Simulation and Characterization

· Packaging Technologies

· Photonics

· Interactive Presentations

Registration is open for the 29th International Conference on Electrical Contacts together with 64th IEEE Holm Conference on Electrical Contacts, which will be held at the Hotel Albuquerque at Old Town, Albuquerque, NM from October 14^th -18^th, 2018. Abstracts have been received from both US and foreign companies and institutions, which form a strong foundation for this international conference on contact and connector technology. All conference information is posted to the website:

http://www.ieee-holm.org/

We look forward to seeing you at the conference.

Dr. Rodney Martens

Conference Chairman

If you wish to receive future communications regarding the upcoming conference, please send an email to holmreg@ieee.org.

ECTC Student Travel Awards

ESTC 2018 - Special Workshops