New EPS PhD Fellowship Nomination Period Now Open
Description/Objective:
To promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.
Prize:
A plaque and a single annual award of US$5,000, applicable towards the student’s research.
Eligibility:
Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field
of interest on a full-time basis from an accredited graduate school or institution.
The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible.
A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship
winner is ineligible.
Nomination Period September 15, 2018 - January 21, 2019
Nomination Form
EPS Supports IEEE TryEngineering Summer Camp
The IEEE TryEngineering summer camps were held at three U.S. colleges: the University of California, Riverside; Texas A&M University; and Vaughn College of Aeronautics and Technology, in New York City. A total of 85 students attended the two-week sessions, held in July. Students in Grades 8 to 12 had the opportunity to build smart cars, erect bridges made from spaghetti, design drones, and compete in rocket challenges. TryEngineering awarded scholarships to 15 students who otherwise would not be able to afford a summer camp. One of the five IEEE societies to provide scholarship funds was EPS.
HIR Workshop at ESTC
Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With the rapid migration of logic, memory and applications to the Cloud infrastructures, Data Centers and 5G Networks, the Internet of Things (IoT) to internet of everything (IOE), Autonomous Vehicles, the proliferation of Smart Devices every where, and increasing interest in 5G, artificial intelligence (AI) & Virtual Reality (VR), the pace of innovation is increasing to meet these challenges. What are the paths forward?
Upcoming Conferences
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Binghamton, NY
Sep 18, 2018 - Sep 19, 2018
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Dresden, Germany
Sep 18, 2018 - Sep 21, 2018
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Sep 23, 2018 - Sep 28, 2018
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Würzburg, Germany
Sep 25, 2018 - Sep 26, 2018
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69th ECTC Call for Papers
Submit an abstract for the 69th IEEE Electronic Components and Technology Conference (ECTC), to be held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.