Are you Interested in Exploring the Latest Challenges and Trends in Heterogeneous Integration and 3D Packaging?

 Join SEMI Europe at the 3D & Systems Summit from January 28 – 30, 2019 in Dresden, Germany!


 

The Summit will address the most relevant and controversial topics related to 3D integration and System-in-Package manufacturing and applications. The event will feature a brand-new agenda, high-caliber speakers, an exhibition area, and unique networking opportunities. The program includes presentations by leading companies ASE, Intel, Amkor, Fraunhofer IZM, imec, GLOBALFoundries, Qualcomm RFFE, STMicroelectronics, Osram, Deca Technologies, and many more!

IEEE EPS members are eligible for an additional ten percent discount using promo code: suQ3w

Register today!

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5 Most Popular Articles according to Xplore® usage statistics

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 

Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ;Ray T. Chen

Publication Year: 2018, Page(s):1695 – 1701


Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

Takafumi Fukushima ; Arsalan Alam ; Amir Hanna ; Siva Chandra Jangam ; Adeel Ahmad Bajwa ; Subramanian S. Iyer

Publication Year: 2018, Page(s):1738 – 1746


Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Suresh V. Garimella ; Tim Persoons ; Justin A. Weibel ; Vadim Gektin

Publication Year: 2017, Page(s):1191 - 1205 


Die Attach Materials for High Temperature Applications: A Review

Vemal Raja Manikam ; Kuan Yew Cheong

Publication Year: 2011, Page(s):457 - 478  

 

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At the December 2018 EPS Board of Governors meeting the Board approved two motions that will change the current Bylaws. The first motion approved changing the Program Director - Membership position to the Vice President - Membership. The duties of the Vice President-Membership include oversight and management of the EPS Society’s membership activities focusing on membership promotion, recruitment, retention, and grade elevation, as well as chairing and coordinating the activities of the Membership Functional Team.  

The second motion approved the addition of a Member at Large position to be filled by a Young Professional representative. The terms of service and term limits will the the same for all Members at Large. The Young Professional Member at Large will be elected by all members of the Society from a slate that is finalized by the Nominations Committee.

Note that in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 1.B and in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 2.C: Once approved by the IEEE Vice President, Technical Activities, the proposed amendment shall be publicized to the membership with notice that it goes into effect unless 40 or more Society members object in writing within 30 days. Please use this communication as notification. 

The 2019 IEEE 5th World Forum on IoT (WF-IoT 2019) will be held on the spectacular parkland setting of the University of Limerick 15-18 April 2019. The historic city of Limerick is located in the heart of the beautiful mid-west region of Ireland, on the magnificent Wild Atlantic Way. We look forward to extending a very special Irish welcome. and invite you to join us in 2019 for a truly memorable event.

The broad-reaching program at WF-IoT attracts industry practitioners, government regulators, public-sector executives, as well as researchers and academics interested in the latest developments, new standards, technical innovations, and first-hand experiences with commercial offerings. This year's theme is “IoT and the Digital Revolution.

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