Upcoming HIR Webinar
We are announcing the Heterogeneous Integration Webinar Series. The series is based upon the content of the 2019 HIR edition. The webinars will be delivered by the authors of the individual roadmap chapters. The primary purposes are to broaden the proliferation of the roadmap content to the profession and industry and to seek feedback from the roadmap users for inclusion into the 2020 edition. Watch for the invitation or visit the EPS website for schedule details and instructions about how to register. The first webinar in the series is:
Title: Heterogeneous Integration Roadmap Driving Force and Enabling Technology for System of the Future
Date: May 6, 2020
Time: 11:00 AM EDT - Register Here
Time: 8:00 PM EDT - Register Here
Presenters: Dr. Bill Chen and Dr. Bill Bottoms
Earn 1 Professional Development Hour (PDH) for completing an EPS webinar - Complete Form
Abstract:
The Heterogeneous Integration Roadmap (HIR) provides a long term vision for the electronics industry, identifying difficult future challenges and potential solutions. The roadmap offers professionals, industry, academia, and research institutes a comprehensive view of the landscape and strategic technology requirements for the electronics industry evolution for the next 15 years, and a 25 years vision for the heterogeneous integration of emerging devices and emerging materials with longer research and development timelines. The purpose is to stimulate pre-competitive collaboration and thereby accelerate the pace of progress.
The HIR is designed to be a system application – driven roadmap, blending the duality of market pull and technology push across the entire electronics ecosystem. The 23 chapters, including the Executive Summary includes market application drivers, building blocks of electronics systems, cross cutting technology areas, and integration technologies, represent the interacting complexities of the electronics industry. This webinar will give an introduction of the Heterogeneous Integration Roadmap. We shall highlight a few of the examples from the chapters and give perspectives of how the roadmap may be used by the profession.
EPTC 2020 Call for Papers
The 22nd Electronics Packaging Technology Conference (EPTC’2020) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC’2020 will feature keynotes, technical sessions, short courses, forums, an exhibition, social and networking activities, including a banquet for all attendees. It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet with leading international experts. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world. EPTC is the flagship conference of IEEE EPS in Region 10.
From CPMT (Components, Packaging, and Manufacturing Technology) to EPS
Author: Jim Morris
Old friends Ron Gedney (CPMT President 1990-1991) and Jim Morris met up again for the first time since the mid-90's in Florida where Ron lives in retirement in Daytona and Jim was attending TAB meetings in Lake Buena Vista. Ron jump-started Jim's 25-year career in multiple CPMT roles when he appointed Jim as CPMT Treasurer in 1990. Ron worked at IBM-Endicott while Jim was just down the road at SUNY-Binghamton and had just been recruited to assist with Bob Howard's new initiatives as the VP of Education. At the time, the CPMT Society had around $150K in the bank and was losing $70K/year, so the outcome was not hard to predict if we did not do something. We proposed and the Board eventually approved a simple change in conference planning. Instead of planning for break-even conferences, we planned for a 15% surplus. Conferences immediately stopped losing money. The Society was also suffering the results of a surfeit of success as the Transactions grew far beyond the budgeted page count. Much to everyone's surprise, when we described our situation, IEEE approved a subscription increase for the Transactions that exceeded all the rules. Although there were some hard feelings when the BoG withdrew its previous support for the Holm Conference's new student scholarship, everyone supported the ten-year goal of establishing a reserve of one year's expenses, and were astonished when it was achieved within less than two years. In the following 25 years, Jim served as Treasurer (1990-1997), Conferences VP (1998-2003), Transactions AE (1998-2015), three terms on the BoG, roughly 20 years on three different ECTC program committees, as General Chair of four CPMT conferences, and in various other roles especially with conferences.
ICSJ 2020 Call for Papers
“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference originally started in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” and was renamed to “ICSJ” in 2010. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology. ICSJ2020 is the commemorative event for 10th ICSJ and 19th conference since establishing VPWJ.
Electronics Packaging for 5G and B5G: The 5G commercial services have just began and provide higher transmission rate, lower latency, greater capacity of remote execution, and larger number of connected devices. The 5G advantages will dramatically advance the performance of IoT services, edge computing, virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI). The future mobile network after 5G, which is called as “beyond 5G (B5G)”, already started technical discussions. The 5G and B5G services will realize Internet of Everything (IoE) services eventually. In 2020, our focus is on key electronics packaging technologies for nextgeneration mobile networks and their applications for 5G and B5G services, and emphasizes on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics, and Sensing Technologies.
Novel SiP/SoP RF Modules and Smart Packaging Enabled by Additive Manufacturing
Authors:
Tong-Hong Lin, Tony He, Bijan Tehrani & Manos M. Tentzeris (Georgia Tech)
I. INTRODUCTION
Additive manufacturing is emerging as a promising alternative to traditional manufacturing methods for use in RF applications. With new areas such as 5G and IoT applications, the need for inexpensive, rapidly deployable and high performance RF systems necessitates the need for additive manufacturing to be incorporated into the fabrication process. Various RF components can be fabricated utilizing additive manufacturing techniques and are summarized in this article which includes cutting edge SiP, SoP and smart module encapsulation.