Power and Energy TC Completes Integrated Power Electronics Chapter of HIR
Patrick McCluskey, EPS Power & Energy Technical Committee Chair
Heterogeneous integration (HI) is not possible without a source of power for the multiple devices and components involved. While it is possible to supply this power externally to one or more devices, it is typically advantageous to integrate the conversion and distribution of this power into the HI system. This makes power delivery one of the most critical elements in an HI system. HI also provides significant advantages for power electronics as it permits wide bandgap power devices, which surpass silicon in power handling capability, efficiency, and operating temperature, to be integrated with silicon control, logic, and memory devices and with lower operating temperature passive devices. Nevertheless, HI of power electronics comes with a raft of challenges for SiP designers, as the power electronics require space, generate heat, and can cause electrical noise in the circuits.
IEEE EPS Technical Committee: High Density Substrates ＆ Boards News
Yasumitsu Orii, High Density Substrates and Boards TC Chair
The High Density Substrates ＆ Boards technical committee (TC-6) of the Electronics Packaging Society EPS is focusing on high-speed and high-density interconnect technologies, based on advanced material-, process-, structure-, and design-technologies. Application areas are ICTs, mobile electronics, automobiles/power electronics, and healthcare. High density substrates and boards are the key components placed in the center of the equipment and always need to be evolved correspondingly to the cutting edge technologies in electrical, optical, and thermal fields.
Call for Participation: Potential IEEE Reusable Packaging Standards/Guidelines
The IEEE SA is considering forming a Pre-standards Reusable Electronics Packaging Activity under the IEEE SA Industry Connections Program to explore development of standards and guidelines for reusable electronics packaging. The IEEE SA Industry Connections Program provides a neutral environment where individuals, entities, partners, and competitors can come together and work on shared problems. Pre-standards Activities explore whether sufficient interest and resources exist to develop a standard and if so draft a proposal for an IEEE standards project. The Pre-standards Activity will address the following:
·Potential market acceptance of the standards project, including technical feasibility
·Relationship to related standards, if known, including its distinct identity from other projects
·Viable leadership and participation
·Realistic scope and objectives
If you would like to participate in this project, or want to learn more about it, please contact Joan Woolery at j.woolery@ieee.org
EP Section within IEEE Access
ESTC 2020 Live September 15 – 18
In response to the COVID-19 situation, ESTC 2020 has moved to a 100% virtual platform, and the conference will be carried out live! The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions. Heterogeneous Integration Roadmap (HIR) workshop, hosted by ESTC, will be held September 15, 9:00 am – 11:50 am Central European Summer Time. The HIR workshop will be open to the general public and is free.
Please view the ESTC 2020 technical program as well as the virtual HIR Workshop at ESTC
We invite you to register now for ESTC: https://www.estc-conference.net/estc-2020/registration-1
Access to the HIR Workshop will be free of charge, and available through a Zoom weblink at https://www.estc-conference.net/estc-2020/hir-workshop
Attendees are advised to download the Zoom client (free of charge) prior to the HIR workshop: https://zoom.us/support/download .