Chair: Dereje Agonafer 

Website: under construction: https://cmte.ieee.org/eps-tmm/

The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest include:

  • Electronic Cooling and Thermal Management of Component and System
  • Thermal Design and Analysis
  • Coupled Electro-Thermal Phenomena
  • Thermal and Thermomechanical Measurements
  • Thermal Mismatches and Stressses
  • Temperature Induced Fracture and Moisture Stresses in IC Package
  • Thermomechanical Design and Analysis of Component and System
  • Thermomechanical Computer Aided Design and Engineering
  • Co-Design
  • Heterogeneous Integration

Read More

Chair: Bing Dang

Status

In the past decades, the driving force for Advanced Packaging has shifted from the traditional PC and server products to 5G mobile devices, IoT devices, wearable devices, automotive electronics as well as medical devices. Great challenges and tremendous opportunities are present in the field of materials and processing. For instance, today’s new car requires as many  as 8,000 active semiconductors in up to 100 interconnected control units. Another example is the miniaturization of  consumer electronics such as smart wearables. Smaller chip package and lower cost call for novel package processes such as FO-WLP and FO-PLP. Higher quality and better performance are required for novel interconnection, dielectric, adhesive, thermal interface materials, as well as substrate materials, etc. The mission of M & P TC is to keep close track of industry trending, build a community for more collaboration, develop insightful guidance for the broad audience in EPS.

Impact routes

Establish monthly or bi-monthly committee meetings

Publish Newsletters on our website

Promote the awareness using social media such as Linkedin

Organize webinars in areas of interest

The growth of data center computing power and the increase in the amount of data being transmitted within and between systems is driving interesting and innovative ways to design electronic systems. Building the systems with robust, predictable, and energy-efficient electrical performance is essential to designing and manufacturing complex systems that scale with the exponential increase in computing and networking operations.

A core interest of members of the IEEE EPS technical committee on EDMS (electrical design, modeling, and simulation) is developing the technology needed to produce these systems. Within EDMS, there are several activities that address the challenges being faced. This article gives an overview of the scope of activities and how EDMS plays a part in supporting the members and the broader community in their efforts.

Read More

By Dr. Willem van Driel, Signify, willem.van.driel@signify.com

Reliability is an essential scientific and technological domain intrinsically linked with system integration. Nowadays, semiconductor industries are confronted with ever-increasing design complexity, dramatically decreasing design margins, increasing chances for and consequences of failures, shortening of product development and qualification time, and increasing difficulties to meet quality, robustness and reliability requirements. The scientific successes of many micro/nano-related technology developments cannot lead to business success without innovation and breakthroughs in the way that we address reliability through the whole value chain.

Read More

Please provide your feedback on what you would like to see in an upcoming issue of the EPS newsletter

Submit Comments here