ITherm 2020 Best Papers Available as Open Access
For a limited time, the best papers and Dick Chu Award paper from ITherm 2020 will be available as open access.
“Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits”
Remco van Erp, Georgios Kampitsis, Luca Nela, Reza Soleimanzadeh Ardebili, Elison Matioli
“General Thermosyphon Simulation Code for Electronics Cooling Applications”
Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
“Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays”
Stoyan Stoyanov, Chris Bailey, Rhys Waite, Christopher Hicks, Terry Golding
“Additively Manufacturing Nitinol as a Solid-State Phase Change Material”
Darin J. Sharar, Adam A. Wilson, Asher Leff, Andrew Smith, K. Can Atli, Alaa Elwany, Raymundo Arroyave, Ibrahim Karaman
Dick Chu Paper Award
Ravi Mahajan
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Call for Papers: Special Issue in memory of Professor Avram Bar-Cohen
Professor Avram Bar-Cohen, past President of IEEE Electronics Packaging Society, and past Editor-in-Chief of the IEEE Transactions on Components and Packaging Technologies passed away on October 10, 2020. He was a giant in the field of thermal management, and made seminal research and professional contributions over a five decade period. Professor Bar-Cohen’s research focused on several areas in microsystems packaging. His work on air cooling focused on optimization of natural and forced air cooling devices, and sustainability and life cycle considerations of thermal management devices. His work spanned the spectrum from fundamental research to emerging applications, including 2.5D and 3D heterogeneous integration, radio frequency, opto-electronics, and power electronics devices and systems.