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IEEE-EPS Malaysia Chapters AGM – 6th Feb 2021

This year IEEE-EPS Malaysia Chapters held their AGM 100% through webinar. Please join me in congratulating the incoming IEEE Electronic Packaging Society Malaysia Section committee that is led by Dr Yik Yee Tan from ON Semiconductor.


for Undergraduate Final Year Project

The winner of this award is Tain Yuan Phin from University Tunku Abdul Rahman (UTAR) supervised by Ts. Dr. Karen Wong Mee Chu from Department of Mechanical & Materials Engineering. 

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The IEEE Electronics Packaging Society is pleased to announce that it has expanded its Certificate Program to include a new EPS Distinguished Achievement Certificate.  This new level of recognition builds on the initial EPS Achievement Certificate aimed at early-career professionals, and provides a pathway for mid-career to late-career professionals to highlight their more advanced level accomplishments.

Criteria for all Certificates: Must be an IEEE Electronics Packaging Society Member

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Abstract— The rapid adoption of 5G mobile networking technology means that packaged ICs have new features and capabilities that present significant test challenges. IC package test requires quick adaptations to address these new test challenges. In this paper we discuss some of the key areas that need innovation to address these test challenges as volume of 5G IC’s rapidly scale. This increases the demand for the development of low cost and scalable high-volume manufacturing test solutions. We discuss the challenges in OTA test, tooling and interconnects, and RF test instruments.

Keywords—5G, mmWave, package test, OTA, RF, Test Instruments, DFT, near field, modulation, sockets, interconnects


As we shift into the new decade, the world is quickly becoming more connected and 5G proliferation is playing a key role. Many aspects and industries are embracing the value of 5G including automotive, health care, the cloud, and creating opportunities for smart homes and cities [1][2]. 5G enabled IC’s are at the center of this evolving infrastructure.

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If you have been involved in the electronics packaging field for 10 years or more, chances are that you probably already have the necessary qualifications to be an IEEE Senior Member.  Senior membership is the highest IEEE membership grade that can be applied for and is a recognition of sustained and significant performance in an IEEE-designated field.  Individuals who are IEEE members can apply themselves for elevation to Senior Member or they can be nominated by others.  Since a member can be nominated by someone else for Senior Membership, Society Chapters can play an important role in helping to identify and support applications for elevation.  Nominating individuals in our Chapters is a great way to recognize their professional achievements and foster deeper personal and professional relationships with our peers.  Individual members shouldn’t hesitate to apply for Senior Member elevation on their own as well, and call upon their IEEE colleagues for support for their application.

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