Title: ML/AI in Semiconductor Packaging and Electronics Manufacturing

Date: 7th Dec 2021 (Tuesday)

Time: 10.00am – 11.00am (M’sia Time, GMT +8:00)

Platform: CISCO WebEx

Presenter: Dr. Dongkai Shangguan, IEEE Fellow, IMAPS Fellow, IEEE EPS Distinguished Lecturer



In the era of “More than Moore” and heterogeneous integration, many advanced semiconductor packaging processes have presented challenges in manufacturing. For example, precision alignment has been one of the key capabilities for several advanced technologies for heterogeneous integration, such as 2.5D/3D, optical assembly, etc.

This talk will present several important applications of ML/AI in semiconductor packaging, optical assembly, PCB assembly and other areas in electronics manufacturing. Applications such as traceability, predictive maintenance, productivity improvement, and process optimization, will be discussed. Various use cases will be discussed to demonstrate how an ML/AI platform at the Edge can be utilized to significantly improve the machine performance as well as yield and throughput for challenging processes. In particular, the presentation will focus on the application of ML/AI for precision alignment using real-time data routinely generated by the machine. Future industry perspectives will be outlined.

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Environmental Sustainability for FHE & Microelectronics

Instructor Dr. Toni Mattila

Sustainability will be a focus area funding in the next SEMI FlexTech Request for Proposals. To assist SEMI & FlexTech members in formulating their proposals and partnerships, we bring you this course on Environmental Sustainability for FHE & Microelectronics.

Sustainability is more a way of thinking than a technological solution. To achieve sustainability, a company must develop a comprehensive approach that covers multiple levels and segments of its business.

Join this course to develop an understanding of the essential components of industrial carbon footprint and discuss actions companies and industry can take to reduce theirs. Throughout the course, Dr. Mattila particular attention to the electronics industry; what the sector has already contributed and what remains to be achieved.

Register here

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You can find the most accessed T-CPMT articles on Xplore here 

The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). It aims to provide a platform for the dissemination of innovations and new developments in semiconductor packaging and component technology, from design to manufacturing. Since its inauguration in 1997, EPTC has been established as a highly reputed electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region 10. It covers diverse areas of electronics packaging technology including modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration, and smart manufacturing. EPTC2021 features keynotes, technology  talks, invited presentations, technical presentations, sponsorship & exhibition corners, and virtual networking activities.

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In honor of the IEEE Women in Engineering 25th anniversary in 2022, the WIE 25th anniversary sub-committee is holding a "Women-to-Women Tech Ideas Dedicated to Women" competition. This competition will highlight the strengths, knowledge, ideas, and creativity that help solve technical problems around the world.


Do you have an innovative idea you would like to submit to the competition? Upload your ideas by 5 December 2021 for review, and a possible opportunity to present your idea to an audience of women in tech at the IEEE WIE International Leadership Conference in San Diego, USA in June 2022. 

25th Anniversary W-To-W Innovative Ideas Application Form

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