May 2018 - IEEE Electronics Packaging Society
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The EPS Board of Governors (BoG) includes 18 Members-at-Large, elected by the full voting membership of the Society. The three-year terms of the Members-at-Large are staggered -- so that six Members-at-Large to the Board of Governors are elected annually.

Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large plus continuing Members-at-Large has the proper proportion of representatives from each Region/grouping of Regions.

Nomination Deadline: June 12, 2018

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Please Submit Nominations online

 

Location: Sheraton San Diego Hotel & Marina

Time: 8:00 a.m. - 5:00 p.m

Room: Executive Center 1 & 4

A Heterogeneous Integration Roadmap workshop, an initiative sponsored by the IEEE EPS, EDS and Photonics Societies and also SEMI and ASME EPPD, will be held on Tuesday, May 29th, from 8 a.m. to 5 p.m. (Room: Executive Center 1 & 4 at Sheraton San Diego) in conjunction with ECTC and ITherm.

This workshop is open to all conference attendees and there is no fee for attendance. Registration is not necessary. So, plan on attending this workshop, if you are keen on learning and contributing to the future directions of heterogeneous integration technologies, serving system integration for future markets and products.

The Test Roadmap Working Group is composed of 145 experts coming from 55 companies world-wide.  This size of a team is appropriate given the complexity of the test in the Semiconductor industry.   Not only do we have responsibility for determining good parts from bad, we also play a commanding role in tracking process parameters, product yields, and product reliability.  Additionally, changes in test are nearly continuous as we strive to keep ahead of the latest industry challenges such as continuing Moore’s law growth which is being compounded by heterogeneous integration techniques, 5G mobile phone components, photonic interfaces, and requirements for data sharing which conflict strongly with security and proprietary data concerns.

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The next EPS Board of Governors (BoG) meeting will be held June 2, 2018 in conjunction with ECTC and ITherm.

All Members are welcome to attend. The Board members will be discussing, among other things, the strategic direction of the Society as well as the latest projects and events the Society is working on. 

Date: Saturday June 2, 2018

Time: 8:00 AM - 5:00 PM 

Location: Sheraton San Diego Hotel & Marina

Room: Seabreeze

 

New "Careers" section on the EPS website.

- Access to the latest job listings on the IEEE Jobsite, including those specifically in packaging

- Access to the IEEE Resume Lab, an online service that allows memberss to develop their resume or CV using a wide variety of templates

- Access to the IEEE Mentoring Program, an online program that facilitates the matching of IEEE members for the purpose of establishing a mentoring partnership. Become a Mentor or a Mentee.

Milpitas, CA USA
Abstract Submission Date: Jun 15, 2018
Sep 13, 2018 - Sep 14, 2018
Oct 24, 2018 - Oct 26, 2018
Kyoto, Japan
Abstract Submission Date: May 25, 2018
Nov 19, 2018 - Nov 21, 2018
Chandigarh, India
Abstract Submission Date: Jul 22, 2018
Dec 16, 2018 - Dec 18, 2018
Dec 17, 2018 - Dec 20, 2018
Toulouse, France
Abstract Submission Date: Nov 17, 2018
Apr 24, 2019 - Apr 26, 2019

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3-D Printed Metal-Pipe Rectangular Waveguides

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Publication Year: 2018, Page(s):73 - 81


Manufacturing Considerations in the 3-D Printing of Fractal Antennas

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