April 2018 - IEEE Electronics Packaging Society
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Webinar: IoT Energy Harvesting

Date: Friday, May 4, 2018

Time: 12:00 PM EDT

Presenters: Dusan Vuckovic, Marc Dunham and Denis Pasero

Host: Brian Zahnstecher

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Earn 1 Professional Development Hour (PDH) for completing the webinar - Complete Form

ABSTRACT:

The Internet of Things (IoT) is already in the process of being integrated into every aspect of our lives, both personally and professionally.  While the definition of an IoT device, wireless sensor network (WSN), or network edge user equipment may be up for debate, there is little disagreement that we can expect many billions if not a trillion or more networked things operating in our world in the next few years.  Most of these devices have very low power requirements and therefore present an excellent opportunity to be powered by ambient energy sources via energy harvesting (EH) modalities.  We have the ability to capture scavenged energy from every form of energy physics affords us, whether it be to source the complete power needs of the device or supplement battery life.

 

This webinar will provide a brief introduction to EH technologies and key design issues/challenges (inc. some related to packaging), discuss some of the latest advancements in EH devices and design innovations, then close with some example solutions in energy storage and real-world applications.  The three distinguished speakers are well-respected, experienced contributors to their respective areas of focus within the EH ecosystem and will provide a unique overview that covers a wide breadth of topics and experience within this domain.

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Date: Tuesday May 29, 2018

Location: Sheraton San Diego Hotel & Marina

Time: 8:00 a.m. - 5:00 p.m

Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With migration of logic, memory and applications to the Cloud, AI at the Edge, the  Internet of Things (IoT) to internet of everything (IOE), smart devices every where, and autonomous automotive, the pace of innovation is increasing to meet these challenges.

 

The Heterogeneous Integration Technology Roadmap (HIR), is sponsored by the IEEE EPS Society, the Electron Devices Society (EDS), Photonics Society together with SEMI and ASME EPPD.  It will address the future directions of heterogeneous integration technologies serving system integration for future markets and products, so very crucial to our societies’ fields of interest and to our industries and academic and research communities. 

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May 29-June 1, 2018 San Diego, CA

The Sheraton Hotel & Marina

San Diego, CA

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.  

ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series. 

ECTC/ITherm Co Sponsored Events:

Young Professionals Panel & Reception

Tuesday, May 29, 2018, 7:00 - 7:45 p.m.

The two panelists will talk about career development for young professionals based on their experiences and achievements in the industry and academia. A reception for panelists and attendees will follow.

1.     Steve Bezuk – Qualcomm Technologies, Inc.

2.     Kathleen Kramer – University of San Diego

 

Women's Panel and Reception Women's Panel and Reception 

Wednesday, May 30, 2018, 6:30 - 7:30 p.m.

Chairs: Cristina Amon - University of Toronto and Tanja Braun - Fraunhofer Institute for Reliability and Microintegration (IZM)

 

IEEE Mentoring Program is an online program that facilitates the matching of IEEE members for the purpose of establishing a mentoring partnership. Become a Mentor or a Mentee

IEEE Job Site - Find a job, get career news and advice, or upload your resume 

Milpitas, CA USA
Abstract Submission Date: Jun 15, 2018
Sep 13, 2018 - Sep 14, 2018
Oct 24, 2018 - Oct 26, 2018
Kyoto, Japan
Abstract Submission Date: May 25, 2018
Nov 19, 2018 - Nov 21, 2018

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Most accessed T-CPMT articles for the month of March 2018

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn


Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Benjamin Goettel ; Wolfgang Winkler ; Akanksha Bhutani ; Florian Boes ; Mario Pauli ; Thomas Zwick


Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland


Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications

Richa Chandel ; Anil Kumar Gautam ; Karumudi Rambabu

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A notification will be sent to all EPS members

Election Principles                                                                                                                                                                                         

The EPS Board of Governors (BoG) includes 18 Members-at-Large, elected by the full voting membership of the Society. The three-year terms of the Members-at-Large are staggered, so that six Members-at-Large to the Board of Governors are elected annually.

Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large plus continuing Members-at-Large has the proper proportion of representatives from each Region/grouping of Regions.

Each Region/grouping of Regions will have a separate slate of candidates from that Region.  Voting members will elect members-at-large from within their Region only (that is, members in Region 8 vote for Members-at-Large from Region 8, members in Region 10 vote for Members-at-Large from Region 10; etc.).

Eligibility                                                                                                                                                                                            

Candidates for Member-at-Large must:                  

     - be a current member of both IEEE and EPS

    - be willing to attend two annual Board meetings

     - be willing to participate actively in areas of their interest (publications, conferences, membership development, chapter development, etc).