5 Most Popular T-CPMT Articles according to Xplore® usage statistics

Using Stepped-Impedance Lines for Common-Mode Noise Reduction on Bended Coupled Transmission Lines

Ding-Bing Lin ; Chung-Pin Huang ; Hsin-Nan Ke

Publication Year: 2016, Page(s):757 - 766 

 

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 


Study of Annular Copper-Filled TSVs of Sensor and Interposer Chips for 3-D Integration

Cao Li ; Jinglong Zou ; Sheng Liu ; Huai Zheng ; Peng Fei

Publication Year: 2019, Page(s):391 – 398

 

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim ; Jun So Pak ; Jonghyun Cho ; Eakhwan Song ;Jeonghyeon Cho ; Heegon Kim ; Taigon Song ; Junho Lee ;Hyungdong Lee ; Kunwoo Park ; Seungtaek Yang ; Min-Suk Suh ;Kwang-Yoo Byun ; Joungho Kim

Publication Year: 2011, Page(s):181 - 195 

 

Novel Electronic Packaging Method for Functional Electronic Textiles

Menglong Li ; John Tudor ; Jingqi Liu ; Russel Torah ; Abiodun Komolafe ; Steve Beeby

Publication Year: 2019, Page(s):216  - 225

 

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