The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements.
Prospective authors should submit a three-page manuscript by August 5, 2019
Notification about acceptance will be given by September 20, 2019.
Accepted papers will be reproduced as-is in the Conference Proceedings.
In addition, authors of accepted papers will be invited to submit an extended version of their manuscript for a Special Section based on EDAPS-2019 to be published in the IEEE Transactions on Components, Packaging and Manufacturing Technology (T-CPMT).