EDAPS 2019 Call for Papers

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements.

DEADLINES

Prospective authors should submit a three-page manuscript by August 5, 2019

Notification about acceptance will be given by September 20, 2019.

Accepted papers will be reproduced as-is in the Conference Proceedings.

In addition, authors of accepted papers will be invited to submit an extended version of their manuscript for a Special Section based on EDAPS-2019 to be published in the IEEE Transactions on Components, Packaging and Manufacturing Technology (T-CPMT).

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