Date: Tuesday May 28, 2019
Location: The Cosmopolitan, Las Vegas NV
Time: 8:00 a.m. - 5:30 p.m
Moderators: William Chen (ASE), Bill Bottoms (3MT Solutions) & Ravi Mahajan (Intel)
Our industry has reinvented itself through multiple disruptive changes in technologies, products, and markets. Our industry continues to change with the rapid migration of logic, memory, and applications to the cloud, the evolution of the Internet of Things (IoT) to the Internet of Everything (IoE), the proliferation of smart devices everywhere, the rise of 5G, the increasing presence of microelectronics in wearables & health application, and in autonomous automotive, and the rapid advancement of AI. The pace of innovation is simultaneously increasing to meet these challenges. The Heterogeneous Integration Roadmap will address the future directions of heterogeneous integration technologies and applications serving the future markets and applications.
The Heterogeneous Integration Roadmap Technical Working Groups are celebrating the completion of the 1st edition of the Heterogeneous Integration Roadmap. The Technical Working Groups will be reporting out their work products and on their plan for the next edition.
We'd like to invite all the ECTC & ITHERM participants to attend this important working session for our profession and for our industry. Registration is not required.
William Chen Bill Bottoms Ravi Mahajan