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The safety and well-being of all conference participants is our priority. IEEE has been continuing to monitor the COVID-19 (coronavirus) pandemic as the situation continues to evolve.

Since the World Health Organization declared COVID-19 to be a pandemic, many governments have enacted travel bans and numerous state and local governments have prohibited large or even moderately-sized public gatherings. Such bans on travel and public gatherings are likely to continue for the foreseeable future.

After studying and evaluating the announcements, guidance, and news released by relevant authorities, we are sorry to announce that the in-person gathering of ECTC and ITherm 2020, scheduled to be held May 26-29th, has been cancelled.

In its place, ECTC and ITherm 2020 will now be held as virtual events. The Organizing Committees are in the process of making arrangements to convert the event into an online format. Information of the virtual event, including how and when it will occur, will be confirmed in the coming days.

Additionally, we realize that we will not be able to deliver the full conference experience that has come to be expected at ECTC, and which our participants, authors, exhibitors and sponsors expected when they registered to attend our 2020 event. As a result, we will be issuing refunds. More information regarding details and timing will be provided shortly.

We appreciate your patience during this transition and look forward to welcoming you at our virtual event in the near future.

With the health and safety of our members and participants being our first priority, please know that our thoughts are with those affected by the COVID-19 outbreak.

We are closely monitoring the developments related to this pandemic and working diligently with the IEEE and our conference organizing committees worldwide, on our preparedness. Some of the conferences sponsored by our society that are scheduled to be held during these challenging few months have been already rescheduled or canceled. Others that are coming up in the later part of this year are carefully watching the developments and ready to make swift decisions, as needed.

This page will be updated on a weekly basis, as the situation keeps changing dynamically.

https://eps.ieee.org/conferences.html

We are announcing the Heterogeneous Integration Webinar Series. The series is based upon the content of the 2019 HIR edition. The webinars will be delivered by the authors of the individual roadmap chapters. The primary purposes are to broaden the proliferation of the roadmap content to the profession and industry and to seek feedback from the roadmap users for inclusion into the 2020 edition. Watch for the invitation or visit the EPS website for schedule details and instructions about how to register. The first webinar in the series is:

Title: Heterogeneous Integration Roadmap Driving Force and Enabling Technology for System of the Future

Date: May 6, 2020

Time: 11:00 AM EDT - Register Here

Time: 8:00 PM EDT - Register Here 

Presenters: Dr. Bill Chen and Dr. Bill Bottoms

Earn 1 Professional Development Hour (PDH) for completing an EPS webinar - Complete Form

Abstract:

The Heterogeneous Integration Roadmap (HIR) provides a long term vision for the electronics industry, identifying difficult future challenges and potential solutions.  The roadmap offers professionals, industry, academia, and research institutes a comprehensive view of the landscape and strategic technology requirements for the electronics industry evolution for the next 15 years, and a 25 years vision for the heterogeneous integration of emerging devices and emerging materials with longer research and development timelines. The purpose is to stimulate pre-competitive collaboration and thereby accelerate the pace of progress.

The HIR is designed to be a system application – driven roadmap, blending the duality of market pull and technology push across the entire electronics ecosystem. The 23 chapters, including the Executive Summary includes market application drivers, building blocks of electronics systems, cross cutting technology areas, and integration technologies, represent the interacting complexities of the electronics industry. This webinar will give an introduction of the Heterogeneous Integration Roadmap. We shall  highlight a few of the examples from the chapters and give perspectives of how the roadmap may be used by the profession.

overview

IEEE realizes that many are directly or indirectly engaged in the fight against COVID-19 and its effects on global health and safety, research, infrastructure, communications, and more. IEEE has identified articles from the IEEE Xplore digital library that may help researchers understand and manage different aspects of the COVID-19 pandemic and technologies that can be leveraged to combat it.

All content in this collection is now free to access, with additional rights for all types of reuse, including full text and data mining, and analysis.  

We are continually monitoring the developments and will update the IEEE Xplore https://ieeexplore.ieee.org content periodically.  If you access IEEE Xplore Digital Library through your institution and you are having access issues when working remotely, try these tips for remote access, or contact IEEE for help.

Thank you for your support of our shared mission to advance technology for humanity.
 

1)       Best Session Paper

Perceval Coudrain, Jean Charbonnier, Arnaud Garnier, Pascal Vivet, Rémi Vélard, Andrea Vinci, Fabienne Ponthenier, Alexis Farcy, Roselyne Segaud, Pascal Chausse, Lucile Arnaud, Didier Lattard, Eric Guthmuller, Giovanni Romano, Alain Gueugnot, Frédéric Berger, Jérôme Beltritti, Therry Mourier, Mathilde Gottardi, Stéphane Minoret, Céline Ribière, Gilles Romero, Pierre-Emile Philip, Yorrick Exbrayat, Daniel Scevola, Didier Campos, Maxime Argoud, Nacima Allouti, Raphaël Eleouet, César Fuguet Tortolero, Christophe Aumont, Denis Dutoit, Corinne Legalland, Jean Michailos, Séverine Chéramy,  Gilles Simon - CEA LETI

“Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures”

2). Best Interactive Presentation Paper

H.T. Hung, S.Yang, I. A. Weng, Y. H. Chen, C. R. Kao-National Taiwan University, Y.H. Chen-Unimicron Corp.

“Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnection”

3). Outstanding Session Paper

Horst Theuss, Christian Geissler, Franz-Xaver Muehlbauer, Claus von Waechter, Thomas Kilger, Juergen Wagner, Thomas Fischer, Ulf Bartl, Stephan Helbig, Alfred Sigl, Dominic Maier, Bernd Goller, Matthias Vobl, Matthias Herrmann, Johannes Lodermeyer, Ulrich Krumbein - Infineon Technologies AG; Alfons Dehe - Hahn-Schickard 

A MEMS Microphone in a FOWLP” 

4). Outstanding Interactive Presentation Paper

Jiefeng Xu, Scott McCann, Huayan Wang, Jing Wang, VanLai Pham, Stephen R. Cain, S.B. Park-The State University of New York at Binghamton, Gamal Refai-Ahmed-Xilinx, Inc.

An Assessment of Electromigration in 2.5D Packaging

Authors :

Amr Helmy, a.helmy@utoronto.ca , Co-Chair, Integrated Photonics Technology Working Group

Gnyan Ramakrishna, Chair, TC Photonics, IEEE EPS

The Heterogenous Integration Roadmap (HIR) includes twenty-two technical working groups that span a wide range of topics within the heterogenous integration effort. Its annual meeting, which was held in the form of a symposium in Santa Clara, California, has recently concluded on February the 20th. Integrated Photonics is one of the notable technical working groups within HIR, represented in the roadmap within the Photonics technical working group (TWG). This article covers the scope of this working group and its planned activities for this year.

Packaged photonics devices cover a vast field of components spanning from components such as laser diodes, light emitting diodes md topical sensors, to circuits including photonic integrated circuits for camera modules, LIDARS and pluggable transceivers just to name a few. There are many unique thermal, electrical and mechanical characteristics which will require specialized materials, purpose-specific packaging, testing and supply chain integration to address upcoming market needs. For instance, for datacenter application, it is envisaged that a migration to 400G pluggable optical transceiver modules is planned for this year with 800G speeds using a QSFP form factor planned shortly after. 

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IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference originally started in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” and was renamed to “ICSJ” in 2010. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology. ICSJ2020 is the commemorative event for 10th ICSJ and 19th conference since establishing VPWJ.

Electronics Packaging for 5G and B5G: The 5G commercial services have just began and provide higher transmission rate, lower latency, greater capacity of remote execution, and larger number of connected devices. The 5G advantages will dramatically advance the performance of IoT services, edge computing, virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI). The future mobile network after 5G, which is called as “beyond 5G (B5G)”, already started technical discussions. The 5G and B5G services will realize Internet of Everything (IoE) services eventually. In 2020, our focus is on key electronics packaging technologies for nextgeneration mobile networks and their applications for 5G and B5G services, and emphasizes on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics, and Sensing Technologies.

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The 22nd Electronics Packaging Technology Conference (EPTC’2020) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC’2020 will feature keynotes, technical sessions, short courses, forums, an exhibition, social and networking activities, including a banquet for all attendees. It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet with leading international experts. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world. EPTC is the flagship conference of IEEE EPS in Region 10.

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Authors:

Tong-Hong Lin, Tony He, Bijan Tehrani & Manos M. Tentzeris (Georgia Tech)

I. INTRODUCTION

Additive manufacturing is emerging as a promising alternative to traditional manufacturing methods for use in RF applications. With new areas such as 5G and IoT applications, the need for inexpensive, rapidly deployable and high performance RF systems necessitates the need for additive manufacturing to be incorporated into the fabrication process. Various RF components can be fabricated utilizing additive manufacturing techniques and are summarized in this article which includes cutting edge SiP, SoP and smart module encapsulation. 

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Author: Jim Morris

Old friends Ron Gedney (CPMT President 1990-1991) and Jim Morris met up again for the first time since the mid-90's in Florida where Ron lives in retirement in Daytona and Jim was attending TAB meetings in Lake Buena Vista. Ron jump-started Jim's 25-year career in multiple CPMT roles when he appointed Jim as CPMT Treasurer in 1990. Ron worked at IBM-Endicott while Jim was just down the road at SUNY-Binghamton and had just been recruited to assist with Bob Howard's new initiatives as the VP of Education. At the time, the CPMT Society had around $150K in the bank and was losing $70K/year, so the outcome was not hard to predict if we did not do something. We proposed and the Board eventually approved a simple change in conference planning. Instead of planning for break-even conferences, we planned for a 15% surplus. Conferences immediately stopped losing money. The Society was also suffering the results of a surfeit of success as the Transactions grew far beyond the budgeted page count. Much to everyone's surprise, when we described our situation, IEEE approved a subscription increase for the Transactions that exceeded all the rules. Although there were some hard feelings when the BoG withdrew its previous support for the Holm Conference's new student scholarship, everyone supported the ten-year goal of establishing a reserve of one year's expenses, and were astonished when it was achieved within less than two years. In the following 25 years, Jim served as Treasurer (1990-1997), Conferences VP (1998-2003), Transactions AE (1998-2015), three terms on the BoG, roughly 20 years on three different ECTC program committees, as General Chair of four CPMT conferences, and in various other roles especially with conferences. 

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