Novel SiP/SoP RF Modules and Smart Packaging Enabled by Additive Manufacturing


Tong-Hong Lin, Tony He, Bijan Tehrani & Manos M. Tentzeris (Georgia Tech)


Additive manufacturing is emerging as a promising alternative to traditional manufacturing methods for use in RF applications. With new areas such as 5G and IoT applications, the need for inexpensive, rapidly deployable and high performance RF systems necessitates the need for additive manufacturing to be incorporated into the fabrication process. Various RF components can be fabricated utilizing additive manufacturing techniques and are summarized in this article which includes cutting edge SiP, SoP and smart module encapsulation. 

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