“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference originally started in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” and was renamed to “ICSJ” in 2010. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology. ICSJ2020 is the commemorative event for 10th ICSJ and 19th conference since establishing VPWJ.
Electronics Packaging for 5G and B5G: The 5G commercial services have just began and provide higher transmission rate, lower latency, greater capacity of remote execution, and larger number of connected devices. The 5G advantages will dramatically advance the performance of IoT services, edge computing, virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI). The future mobile network after 5G, which is called as “beyond 5G (B5G)”, already started technical discussions. The 5G and B5G services will realize Internet of Everything (IoE) services eventually. In 2020, our focus is on key electronics packaging technologies for nextgeneration mobile networks and their applications for 5G and B5G services, and emphasizes on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics, and Sensing Technologies.