Title: Avoiding inelastic strains in solder joint interconnections of IC packages
Presenter: Dr. Ephraim Suhir, Portland State University, Portland, OR, USA
Date: Thursday, April 22, 2021
Time: 5:00 - 6:30 PM (PDT)
Abstract: The following three practically important questions associated with predicting and improving the reliability of solder joint interconnections (SJI) of IC packages are addressed in this seminar: (a) Could inelastic strains in the solder material be avoided by a rational design, and if not, could the sizes of the inelastic strain areas be predicted and , if possible, minimized? (b) Considering that the difference between an highly reliable and an insufficiently reliable product is “merely” in the level of its never-zero probability of failure, and that SJIs are usually the most vulnerable structural elements in an IC package design, could this probability be assessed at the design stage and, if possible, made adequate for the given application? (c) Should temperature cycling accelerated testing for SJIs be replaced with a more physically meaningful, less costly, less time- and labor- consuming and, most importantly, less misleading accelerated test vehicle? Dr. Suhir will cover these topics from his book linked here. IEEE EPS/EDS Pittsburgh Webinar: Avoiding inelastic strains in solder joint interconnections of IC packages.