Title: Trends in Thermal Management of Electronic Systems
Date: 09 Jun 2021
Time: 04:30 PM to 05:45 PM (All times are Europe/Zurich)
Abstract: This webinar will include a talk on roadmap of thermal management in heterogenous integration and two talks on trends in advancing thermal management for high power devices.
16:30 - 16:35 : Welcome and Introduction
16:35 - 17:10 : "Heterogeneous Integration Roadmap Thermal Technical Working Group (TWG) Update", Dr. Weihua Tang, Intel Corporation, USA
17:10 - 17:25 : "Passive two-phase cooling in power electronics", Dr. Daniele Torresin, Principal Scientist, ABB Research Center, Switzerland
17:25 - 17:40 : "Active cooling: a solution for low TCE, high thermal conductivity packages", Dr. Arno Hoogerwerf, Senior Expert, CSEM SA, Switzerland
17:40 - 17:45 : General discussions and closure
The video conferencing link will be provided to registered attendees.