IEEE EPS Switzerland Chapter Webinar

Title: Trends in Thermal Management of Electronic Systems

Date: 09 Jun 2021

Time: 04:30 PM to 05:45 PM (All times are Europe/Zurich)

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Abstract: This webinar will include a talk on roadmap of thermal management in heterogenous integration and two talks on trends in advancing  thermal management for high power devices.


16:30 - 16:35 : Welcome and Introduction

16:35 - 17:10 : "Heterogeneous Integration Roadmap Thermal Technical Working Group (TWG) Update", Dr. Weihua Tang, Intel Corporation, USA

17:10 - 17:25 : "Passive two-phase cooling in power electronics", Dr. Daniele Torresin, Principal Scientist, ABB Research Center, Switzerland

17:25 - 17:40 : "Active cooling: a solution for low TCE, high thermal conductivity packages", Dr. Arno Hoogerwerf, Senior Expert, CSEM SA, Switzerland

17:40 - 17:45 : General discussions and closure 


The video conferencing link will be provided to registered attendees.