Upcoming EPS Technical Webinar

Title: Advanced Packaging in Hyperscale Data Center Applications

Date:  May 6, 2022

Time:  12:00 pm EDT

Platform:  Webex

Presenter: Jie Xue, Vice President Technology & Quality, Cisco Systems, Inc.

Register here


Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing in performance while reducing power per Gbps. Challenges toward device integration, reliability and industry eco-system collaboration will also be elaborated.

BioJie Xue leads Cisco’s Technology and Quality organization, a global team responsible for pathfinding, developing, and executing technology innovations to enable all Cisco networking product portolio. Jie oversees development of leading edge technologies for Si-Photonics, Advanced Si, ASICs, PCBs, Optics, memory, and complex interconnect technologies.

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