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The EPS Board of Governors voted unanimously to establish a PhD Fellowship award in the area of electronics packaging. Graduate Students - Here is what you need to know:

Description/Objective:

To promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest.

Prize:  

A plaque and a single annual award of US$5,000, applicable towards the student’s research.

Eligibility:

Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field

of interest on a full-time basis from an accredited graduate school or institution.

The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible.

A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship

winner is ineligible.

Nomination Period to Open September 15

Please refer to the EPS website for additional details

The voting period for EPS Members At Large will open September 4, 2018. All voting members of the Society will receive a notification. 

The IEEE Electronics Packaging Society Constitution and Bylaws provide that each year the membership shall elect six Members-at-Large to the Society Board of Governors to serve a three-year term. Members-at-large will be elected to achieve totals proportionate to the geographic distribution of EPS members. For 2018, this translates as follows:

  • Regions 1-6, 7 and 9 (US, Canada, South and Central America):  elect 3 members 
  • Region 8 (Europe, Africa, Middle East):  elect 0 member
  • Region 10 (Asia/Pacific):  elect 3 members 

The six newly elected Members-at-Large will join continuing Members-at-Large (shown below) on the Board of Governors: 

2019 term-end:

Regions 1-6,7,9: Li Li, David McCann, Kitty Pearsall, Subramanian S. Iyer

Region 8:  Thomas Brunschwiler, Gilles Poupon

2020 term-end:

Regions 1-6, 7,9 -- Alan Huffman, Sam Karikalan, Xuejun Fan, Jeffrey C. Suhling;

Region 8 -- Grace O'Malley; Region 10 -- Yoichi Taira

Voting members will elect Members-at-Large from within their respective Regions only, that is, members in Region 10 will vote for Members-at-Large from Region 10 only, etc.

The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.

EPS Major Awards

A series of EPS Major Awards, recognizing  technical contributions and service, is administered by the EPS Awards Committee:

 Nomination period will open September 15

Description/Objective:

To promote student participation at the ECTC, EPS has travel to ECTC for 8 students.

 

Prize:  

A certificate and reimbursable travel expenses up to the limits of $1,300 US for students at US institutions and $2,100 US for students at non-US institutions.

 

Eligibility:

Twenty candidates are preliminary selected based on the ECTC technical committee scoring and a balance among the various committees. The student paper must be accepted to be presented at the conference, and the student must be the presenter and the paper first author. The candidates are requested to submit an extended abstract.  A committed of up to 5 evaluators then rate the extended abstracts and the top 8 are selected for the travel award. 

New promotion to Latin American Students

An expansion of the ECTC student travel award program in support 2 graduate-level students from under-represented geographies at the ECTC was approved by the Board of Governors. Up to 2 students with accepted ECTC papers from Latino-America, Region 9,  will be given travel a award.  This is the first step in promoting EPS growth in Latino-America. 

The Heterogeneous Integration Roadmap (HIR) held another successful workshop at SEMICON West. There was representation from Europe, Asia and the US. Twenty three participants attended the July 8th meeting and twenty nine attended the July 9th meeting held at the Moscone Center in San Francisco. Ajit Manocha, SEMI President & CEO and member of the HIR Global Advisory Council, opened the Monday session. Hubert Lakner, HIR Global Advisory Council member, also attended SEMICON West. 

 

Picture1Semicon West

Upcoming HIR Workshops

INTERPACK 2018

Thursday, August 30, 2018
Hilton San Francisco
San Francisco, CA
 

Electronics Packaging Symposium

Tuesday, September 18, 2018
Binghamton University
Binghamton, NY
 

ESTC 2018

Wednesday, Septenmber 19, 2018
Westin Bellvue
Dresden, Germany

Additional HIR workshops will be held throughout the remainder of the year. Please refer to the EPS website

ESTC 2018 has several Special Workshops scheduled for Wednesday afternoon, September 19th.

Hot topics in the field of electronic packaging are presented and discussed. Share your experiences and opinions with colleagues.

Access to those Special Workshops is included in the conference fee.

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Registration is open for the 29th International Conference on Electrical Contacts together with 64th IEEE Holm Conference on Electrical Contacts, which will be held at the Hotel Albuquerque at Old Town, Albuquerque, NM from October 14th -18th, 2018.  Abstracts have been received from both US and foreign companies and institutions, which form a strong foundation for this international conference on contact and connector technology.  All conference information is posted to the website:

 

http://www.ieee-holm.org/

We look forward to seeing you at the conference.

Dr. Rodney Martens

Conference Chairman

If you wish to receive future communications regarding the upcoming conference, please send an email to holmreg@ieee.org. 

The 2019 IEEE 69th Electronic Components and Technology Conference
The premier international packaging, components, and
microelectronics systems technology conference

You are invited to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following:

·  Applied Reliability

·  Assembly and Manufacturing Technology

·  Emerging Technologies

·  High Speed, Wireless and Components

·  Interconnections

·  Materials & Processing

·  Thermal/Mechanical Simulation and Characterization

·  Packaging Technologies

·  Photonics

·  Interactive Presentations

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Important Dates

 

Deadline for Abstracts: September 3, 2018

Notification of Acceptance: October 15, 2018

Draft Paper Submission:  December 17, 2018

Reviews Returned:  February 4, 2019

Final Paper Submission:  March 4, 2019

 

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Materials Impurities and Logic/Memory Errors:  Join us on 24 October for the worldwide 10th EPS Soft Error Rate Workshop (no cost: in person or via full-day webinar).  As packaging is developed for denser ICs and 2.5 and 3D, minor radioactive impurities can have a larger effect on system integrity.  Presenters from IBM, Xilinx, Los Alamos Nat’l Lab, HPE, Stanford, Vanderbilt, SpaceX, Cypress Semi, Nvidia, STMicro and others will discuss issues, metrology, and use cases.  Download past slides and view past presentations of interest.

For more information and to register:http://www.cpmt.org/scv/?p=679

 

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