Submit your abstract for the 69th ECTC!

The 2019 IEEE 69th Electronic Components and Technology Conference
The premier international packaging, components, and
microelectronics systems technology conference

You are invited to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following:

·  Applied Reliability

·  Assembly and Manufacturing Technology

·  Emerging Technologies

·  High Speed, Wireless and Components

·  Interconnections

·  Materials & Processing

·  Thermal/Mechanical Simulation and Characterization

·  Packaging Technologies

·  Photonics

·  Interactive Presentations

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