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The IEEE Electronics Packaging Society is launching a new open access section hosted in IEEE Access. The new section, which will be fully compliant with funder mandates, including Plan S, will begin accepting submissions in fall 2019 and publish its first articles once peer review is complete.  The new section of IEEE Access will have an established peer review process, and an accomplished expert as Topical Editor, Dr. Ravi Mahajan.  

For more information about the Electronics Packaging section, please visit open.ieee.org or complete the form to receive an email when IEEE Access will begin accepting submissions.

In order to further the education of Electronics Packaging Society (EPS) members, the EPS is now offering a Certificate Program. The goal of the program is to give members new to electronics packaging an opportunity for further packaging education, offer continuous education in electronics packaging to existing members, and also to offer students electronics packaging training if they are in a University program that does not include packaging education.

 Criteria: Must be an IEEE Electronics Packaging Society Member 

 To receive your certificate, 15 professional development hours (PDHs) must be completed. This can be obtained from a combination of the following: 

 1). IEEE EPS Webinar (1 PDH) – must complete PDH evaluation 

 2). Professional Development Courses – must complete survey and CEU credit form. Previous PDCs from the last 10 years can be used towards this if  the CEU application was completed at the time of the course. 

 - Electronic Components and Technology Conference (USA)  = 4 PDHs 

 - Electronic Systems-Integration Technology Conference (Europe) = 3 PDHs 

 - Electronic Packaging Technology Conference (Asia) = 4 PDHs 

 3). Author of IEEE T-CPMT and/or EPS conference paper(s) (5 PDHs) – paper must be published in IEEE Xplore within the last 5 years. 

 4). Reviewer for IEEE T-CPMT (3 Reviews = 5 PDH) within the last 5 years. 

 Once you have completed any combination of the above and received 15 PDHs, please complete the certificate form to request your Electronics Packaging Society Certificate. 

 

Congratulations to these EPS Members on receiving the IEEE Certificate of Achievement from the IEEE Electronics Packaging Society and completing the required number of professional development hours. 

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The Electronics Packaging Society collaborates and cooperates with other IEEE Societies as well as with other professional associations through initiatives, publications, conferences and councils. There are a number of opportunties for you to get involved in the various activities.

For a complete list, please refer to the Society website.

If you are interested please contact the EPS Executve Office.

 The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Cosmopolitan Hotel and Casino in Las Vegas, NV from May 28 – May 31, 2019. This was the 31st Anniversary of ITherm, first held in 1988.  The conference was historically held every other year until 2016 when it switched to an annual schedule, making this the 18th ITherm. ITherm 2019 was sponsored by the IEEE Electronics Packaging Society (EPS) and co-located with the 69th Electronic Components and Technology Conference (ECTC 2019). ITherm is also an IEEE EPS partner conference of the International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) in Europe and the Electronics Packaging Technology Conference (EPTC) in Asia.

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Join us for the 31st Annual Electronics Packaging Symposium at GE's Research campus in Niskayuna, NY on September 5 and 6, co-organized by Binghamton University's Integrated Electronics Engineering Center (IEEC), GE Research and IEEE EPS. Bringing together top leaders and experts from industry, academia and government to discuss the latest advances in bioelectronics, 5G,MEMS, wearables for medical applications, additive for electronics and much more. To LEARN MORE and to REGISTER, visit our Symposium website

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Submission Guidelines

 

The content must be original, previously unpublished, non-confidential and without commercial content. All abstracts and proposals must be submitted electronically at our website by 6 October 2019. Selected authors and instructors will be announced by 9 December 2019. The first 100 people to submit abstracts will be entered into a drawing to win a free ECTC 2020 registration. 

 

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comcas

 On November 4-6 2019 in Tel Aviv, IEEE COMCAS will host the microwave, communications, antennas and electronic systems community for the 7th time in Israel, through its multidisciplinary forum for over 1600 scientists, engineers and managers/decision makers from academia, industry and government, to:

·         Exchange ideas

·         Get updates on the latest research results and industry experiences

·         Meet and learn from leading experts and speakers

·         Participate in attractive workshops, invited panels and interactive seminars

 

IEEE COMCAS 2019 continues to be the premier event in its fields. Major topics being planned for 2019 include Technology Innovations, Digital Radar, Microwave Components Design with EM Simulation, Space Oriented Technology, Advanced Packaging and Thermal Management, Bio-Medical Engineering, 5G and Beyond, and "Internet of Things" Communications. 

To complement the robust technical program, a world class exhibition will showcase the latest technologies, products and solutions from top suppliers and experts, also including Microwave and Wireless Applications (WirelessApps) seminars.

In addition, with a focus on professional careers, IEEE COMCAS 2019 will host an IEEE Young Professionals and Women in Engineering (WIE) activities. We invite you to attend!

 

 

For IEEE COMCAS program and registration! >> http://bit.ly/2KpARvW

 

The UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) would like to provide you with an opportunity to present a poster about your research and network with our attendees at the 2019 UCLA CHIPS Workshop. The workshop will take place on Wednesday, November 6, 2019 at UCLA.

 

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The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of main events in South Asia and Asia Pacific design communities, which attracts world class designers and researchers to share their most recent results related to modeling, simulation, and electrical design at on-chip, package, and system/module levels. The symposium consists of tutorials, oral presentations (including Keynote addresses), industry exhibition, invited (workshop), and interactive poster presentations. The technical program of the symposium addresses the current technical issues facing design in IC, SiP/SoP packaging, EMI/EMC, RF isolation, and most importantly applications of AI/Machine learning in the next generation design of 3D IC (SoC, RF CMOS, RF SoC), FO/InFO PoPs, heterogeneous RF-passives systems, and EDA tools with AI-assisted smart.

Taiwan is famously known as Silicon Island, which has played a leading role in design, fabrication, and manufacturing services at chip, package, and board levels. Let’s all participate this highly anticipated event where knowledge sharing and cordial exchanges between the academia and industry will surely take place.

IEEE EDAPS 2019 will be held in Kaohsiung, Taiwan on Dec. 16-18, 2019.

  

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