Electronics Packaging Section within IEEE Access

OA

The IEEE Electronics Packaging Society is launching a new open access section hosted in IEEE Access. The new section, which will be fully compliant with funder mandates, including Plan S, will begin accepting submissions in fall 2019 and publish its first articles once peer review is complete.  The new section of IEEE Access will have an established peer review process, and an accomplished expert as Topical Editor, Dr. Ravi Mahajan.  

For more information about the Electronics Packaging section, please visit open.ieee.org or complete the form to receive an email when IEEE Access will begin accepting submissions.