Most Popular T-CPMT Articles

5 Most Popular Articles according to Xplore® usage statistics

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 

 

Die Attach Materials for High Temperature Applications: A Review

Vemal Raja ManikamKuan Yew Cheong

Publication Year: 2011, Page(s): 457 - 478

 

Stochastic Collocation With Non-Gaussian Correlated Process Variations: Theory, Algorithms, and Applications

Chunfeng Cui Zheng Zhang

Publication Year: 2019, Page(s): 1362 - 1375

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau Ming Li Dewen Tian Nelson Fan Eric Kuah Wu Kai Margie Li J. Hao Yiu Ming Cheung Zhang Li Kim Hwee Tan Rozalia Beica Thomas Taylor Cheng-Ta Ko Henry Yang Yu-Hua Chen Sze Pei Lim Ning Cheng Lee Jiang Ran Cao Xi Koh Sau Wee ;Qingxiang Yong

Publication Year: 2017, Page(s): 1729 - 1738


High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
 

Joohee Kim ; Jun So Pak ; Jonghyun Cho ; Eakhwan Song ;Jeonghyeon Cho ; Heegon Kim ; Taigon Song ; Junho Lee ;Hyungdong Lee ; Kunwoo Park ; Seungtaek Yang ; Min-Suk Suh ;Kwang-Yoo Byun ; Joungho Kim

 

Publication Year: 2011, Page(s):181 - 195  

 

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