Electronics Packaging Symposium

Join us for the 31st Annual Electronics Packaging Symposium at GE's Research campus in Niskayuna, NY on September 5 and 6, co-organized by Binghamton University's Integrated Electronics Engineering Center (IEEC), GE Research and IEEE EPS. Bringing together top leaders and experts from industry, academia and government to discuss the latest advances in bioelectronics, 5G,MEMS, wearables for medical applications, additive for electronics and much more. To LEARN MORE and to REGISTER, visit our Symposium website

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