EDAPS 2019 submission deadline extended to Sept 15, 2019

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of main events in South Asia and Asia Pacific design communities, which attracts world class designers and researchers to share their most recent results related to modeling, simulation, and electrical design at on-chip, package, and system/module levels. The symposium consists of tutorials, oral presentations (including Keynote addresses), industry exhibition, invited (workshop), and interactive poster presentations. The technical program of the symposium addresses the current technical issues facing design in IC, SiP/SoP packaging, EMI/EMC, RF isolation, and most importantly applications of AI/Machine learning in the next generation design of 3D IC (SoC, RF CMOS, RF SoC), FO/InFO PoPs, heterogeneous RF-passives systems, and EDA tools with AI-assisted smart.

Taiwan is famously known as Silicon Island, which has played a leading role in design, fabrication, and manufacturing services at chip, package, and board levels. Let’s all participate this highly anticipated event where knowledge sharing and cordial exchanges between the academia and industry will surely take place.

IEEE EDAPS 2019 will be held in Kaohsiung, Taiwan on Dec. 16-18, 2019.


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