Impressive turn-out for the virtual 70th ECTC

Eric Perfecto, 71st ECTC Publicity Chair

The Coronavirus pandemic necessitated the IEEE Electronic, Components and Technology Conference (ECTC) to move into a virtual format this year.  Due to the generous support from IEEE EPS and our corporate sponsors, the in-person event was transformed into a free-to-attend on-demand virtual conference.  Over 7,700 individuals took advantage of this offer and attended the virtual conference, which consisted of over 400 presentations organized into 45 technical sessions and 7 special invited sessions.  The virtual conference opened on June 3, 2020 and after a one-week extension, closed on July 7, 2020.  The attendance covered 55 countries and over 28,000 hours of streamed content viewed.

The technical program can be seen here:  Table 1 shows the top ten most attended sessions.  Advanced packaging technologies, such as Wafer-level Fan-out packaging and 3D, had the highest attendance of the technical and special sessions, with special mention to the keynote lecture from Dr. Douglas Yu of TSMC titled “Innovative Heterogeneous Integration Technologies Initiate a New Era” which got almost over 2,000 views.

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