Date : Nov. 12th,13th 2020
Location: Silicon Valley, CA, USA
Abstract due date: September 15th 2020.
Proposals for presentations as an abstract in the fields of Reliability for Electronic and Photonic Packaging are solicited under the technical areas highlighted in this link <https://attend.ieee.org/repp/> .
This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging.
The Symposium is driven by Photonics and Reliability technical committees of EPS and sponsored by EPS and IEEE Santa Clara Chapter.
COVID-19 : Due to the evolving nature of the pandemic, the platform that the Symposium will be delivered will be decided by end of September 2020.
REPP Symposium Committee