EPEPS Conference Oct 4-7, 2020

The 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) will take place on Oct 4-7, 2020.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

This year’s EPEPS conference will be virtual. Technical program consists of technical presentation, tutorials, and keynotes. The keynote presentations for this year are:

·       Jim Held (Intel): “Meeting the Challenge of Building a Scalable Quantum Computer”  

·       Daniel Dreps (IBM): “High Speed and Large Bandwidth Server Computer Bus Links: Past Milestones, Current State of The Art and Future Directions”

Please visit www.epeps.org for more details with regard to the technical program and the registration options for both attendees and sponsors.

Kemal Aygun (Intel)