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In order to further the education of Electronics Packaging Society (EPS) members, the EPS is now offering a Certificate Program. The goal of the program is to give members new to electronics packaging an opportunity for further packaging education, offer continuous education in electronics packaging to existing members, and also to offer students electronics packaging training if they are in a University program that does not include packaging education.

Criteria: Must be an IEEE Electronics Packaging Society Member

To receive your certificate, 15 professional development hours (PDHs) must be completed. This can be obtained from a combination of the following:

1). IEEE EPS Webinar (1 PDH) – must complete PDH evaluation

2). Professional Development Courses – must complete survey and CEU credit form. Previous PDCs from the last 10 years can be used towards this if  the CEU application was completed at the time of the course.

- Electronic Components and Technology Conference (USA)  = 4 PDHs

- Electronic Systems-Integration Technology Conference (Europe) = 3 PDHs

- Electronic Packaging Technology Conference (Asia) = 4 PDHs

3). Author of IEEE T-CPMT and/or EPS conference paper(s) (5 PDHs) – paper must be published in IEEE Xplore within the last 5 years.

4). Reviewer for IEEE T-CPMT (3 Reviews = 5 PDH) within the last 5 years.

Once you have completed any combination of the above and received 15 PDHs, please complete the certificate form to request your Electronics Packaging Society Certificate.

Description: This award recognizes the best "Vision of the Future of Electronics Packaging" abstract, to be presented at the IEEE Electronic Components and Technology Conference (ECTC) during the Tuesday evening panel session.  The competition welcomes submissions from all IEEE Students, Graduate Students and Young Professionals*.

 * A Young Professional is an IEEE member that has completed their first academic degree within the last 15 years. 


Presented to: An individual or a team of not more than three.  


Prize: Up to three awards will be provided to an individual or team. The prize will be $500 for each winner (if one of the winners is a team, $500 will be awarded to each member of the team). Travel grants will be provided to attend ECTC, and applied toward actual travel expenses including airfare, hotel and meals. Up to $1,000 for US based winners and up to $1,500 for Non US winners. Proof of travel expenses including receipts will need to be submitted for the reimbursements to be dispersed. Travel funding can be used for an individual or shared among the team (Total funding $1,000 per US team; Total funding $1,500 per Non US team).  


Eligibility: All ECTC and ITherm attedees. Winners are required to present their packaging visions at the ECTC Tuesday evening Panel Session.  


Basis for Judging: Judges will be selected members of the EPS Emerging Technology Technical Committee, the EPS VP-Technology, and the EPS President as an ex-officio member. Submissions are judged based on technical innovation, merit, originality, relevance and potential impact on the electronics packaging field. If no submissions are deemed to be of prize quality, an award will not be granted.  


Presentation: The award will be presented at the EPS luncheon held during IEEE Electronic Components and Technology Conference (ECTC).    


Submit an Abstract 


The EPS Awards Program recognizes contributions to the profession, industry and the Society through a comprehensive set of awards and recognitions.

A series of EPS Major Awards, recognizing technical contributions and service, is administered by the EPS Awards Committee:

·       Outstanding Sustained Technical Contribution Award
·       Electronics Manufacturing Technology Award
·       David Feldman Outstanding Contribution Award
·       Exceptional Technical Achievement Award
·       Outstanding Young Engineer Award

Nomination Period September 15, 2018 - January 21, 2019
Nomination Form

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Description/ObjectiveTo promote, recognize, and support PhD level study and research within the Electronics Packaging Society’s field of interest. 

Prize: A plaque and a single annual award of US$5,000, applicable towards the student’s research.

Eligibility:Candidate must be an IEEE EPS member, at the time of nomination, and be pursuing a doctorate degree within the EPS field of interest on a full-time basis from an accredited graduate school or institution. The candidate must have studied with her/his advisor for at least 1 year, at the time of nomination, to be eligible. A Student who received a Fellowship award from another IEEE Society, within the same year, or is a previous EPS Fellowship

winner is ineligible.  

Nomination Period September 15, 2018 - January 21, 2019  

Nomination Form 

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The 2019 IEEE 5th World Forum on IoT (WF-IoT 2019) will be held on the spectacular parkland setting of the University of Limerick 15-18 April 2019. The historic city of Limerick is located in the heart of the beautiful mid-west region of Ireland, on the magnificent Wild Atlantic Way. We look forward to extending a very special Irish welcome. and invite you to join us in 2019 for a truly memorable event.

The broad-reaching program at WF-IoT attracts industry practitioners, government regulators, public-sector executives, as well as researchers and academics interested in the latest developments, new standards, technical innovations, and first-hand experiences with commercial offerings. This year's theme is “IoT and the Digital Revolution.

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Are you Interested in Exploring the Latest Challenges and Trends in Heterogeneous Integration and 3D Packaging?

 Join SEMI Europe at the 3D & Systems Summit from January 28 – 30, 2019 in Dresden, Germany!


The Summit will address the most relevant and controversial topics related to 3D integration and System-in-Package manufacturing and applications. The event will feature a brand-new agenda, high-caliber speakers, an exhibition area, and unique networking opportunities. The program includes presentations by leading companies ASE, Intel, Amkor, Fraunhofer IZM, imec, GLOBALFoundries, Qualcomm RFFE, STMicroelectronics, Osram, Deca Technologies, and many more!

IEEE EPS members are eligible for an additional ten percent discount using promo code: suQ3w

Register today!

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5 Most Popular Articles according to Xplore® usage statistics

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 

Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ;Ray T. Chen

Publication Year: 2018, Page(s):1695 – 1701

Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

Takafumi Fukushima ; Arsalan Alam ; Amir Hanna ; Siva Chandra Jangam ; Adeel Ahmad Bajwa ; Subramanian S. Iyer

Publication Year: 2018, Page(s):1738 – 1746

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Suresh V. Garimella ; Tim Persoons ; Justin A. Weibel ; Vadim Gektin

Publication Year: 2017, Page(s):1191 - 1205 

Die Attach Materials for High Temperature Applications: A Review

Vemal Raja Manikam ; Kuan Yew Cheong

Publication Year: 2011, Page(s):457 - 478  


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At the December 2018 EPS Board of Governors meeting the Board approved two motions that will change the current Bylaws. The first motion approved changing the Program Director - Membership position to the Vice President - Membership. The duties of the Vice President-Membership include oversight and management of the EPS Society’s membership activities focusing on membership promotion, recruitment, retention, and grade elevation, as well as chairing and coordinating the activities of the Membership Functional Team.  

The second motion approved the addition of a Member at Large position to be filled by a Young Professional representative. The terms of service and term limits will the the same for all Members at Large. The Young Professional Member at Large will be elected by all members of the Society from a slate that is finalized by the Nominations Committee.

Note that in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 1.B and in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 2.C: Once approved by the IEEE Vice President, Technical Activities, the proposed amendment shall be publicized to the membership with notice that it goes into effect unless 40 or more Society members object in writing within 30 days. Please use this communication as notification.