Are you Interested in Exploring the Latest Challenges and Trends in Heterogeneous Integration and 3D Packaging?
Join SEMI Europe at the 3D & Systems Summit from January 28 – 30, 2019 in Dresden, Germany!
The Summit will address the most relevant and controversial topics related to 3D integration and System-in-Package manufacturing and applications. The event will feature a brand-new agenda, high-caliber speakers, an exhibition area, and unique networking opportunities. The program includes presentations by leading companies ASE, Intel, Amkor, Fraunhofer IZM, imec, GLOBALFoundries, Qualcomm RFFE, STMicroelectronics, Osram, Deca Technologies, and many more!
IEEE EPS members are eligible for an additional ten percent discount using promo code: suQ3w