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To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award. 

EPS has initiated the student chapter promotion program to promote the formation of 10 more new student chapters in 2020/21. Six students from any university which has an IEEE student branch who are willing to serve as executive committee (exco) members in a new student chapter will be given free IEEE+EPS student memberships. Additionally, faculty members who are willing to serve as Advisors to new student chapters will also be given free IEEE+EPS memberships.

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Dates: Thursday, 20 February and Friday 21 February 2020

Cost: $60 General Admission; $50 IEEE/ASME members and employees of SEMI member companies

Location: SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas CA USA


Day 1: Implementation of HIR v1.0
— Keynotes on Future Implementations and Challenges
— Moderated Panels on Key Aspects of the Released Roadmap

Day 2: TWG Breakout Sessions for HIR v2.0 (Cross-Working Group meetings)


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2019 can be seen as a continuation of 2018 - a new opportunity to promote the vision of SBC which represents a close collaboration between professors, professionals and students alike to different important events with the aim of driving the future of technology by improving the quality of education. Among the ones attended by our members are PCNS, EMPC and SIITME and are described, in detail, below.

Passive Components Networking Symposium (PCNS) is a bi-annual international symposium organized by the European Passive Components Institute (EPCI) in co-operation with the Faculty of Electronics, Telecommunication and Information Technology within University Politehnica of Bucharest, from 10th – 13th September in Bucharest, Romania. In its second edition, the principal ideas covered by this two-day event are related to design, materials developments, technology, reliability and application of passive electronic components for use in wide range of applications.


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ESTC 2020 pic

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. This international event brings together both academics and industry leaders to present and discuss the state-of the-art as well as the future trends in electronics packaging and integration technologies. ESTC offers excellent opportunities for knowledge exchange and networking with international experts in the field.

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Get the Latest Insights in Emerging Technologies, 3D Packaging, Systems Applications and Future Market Opportunities

IEEE Electronic Packaging Society (EPS) members are eligible for a ten percent discount using promo code: 3DS2020-FAQCw

Start the New Year Off Right: 

Join SEMI Europe at the 3D & Systems Summitfrom January 27 – 29, 2020 in Dresden, Germany!

· The conference will feature the latest insights and developments in 3D integration and systems for semiconductor manufacturing, focusing on high-reliability, high-performance disruptive applications such as mobile and IoT.

 · The exclusive exhibition area will showcase the most prominent names in the industry alongside new and innovative start-up companies and will include business-to-business matchmaking and networking opportunities.

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Special Section on the reliability of advanced microelectronic packaging

Modern technologies including smart phones, computers, industrial automation, automobiles, and internet are made possible by integrated circuits and the associated packages. The package needs to possess a certain level of reliability to carry out its intended task. The IEEE defines reliability as the ability of an item to perform a required function under stated conditions for a stated period of time. The reliability of advanced microelectronic packaging has emerged as the top priority across the hottest growth markets for semiconductors, including automotive, industrial and cloud-based computing. The reliabilities of mission-critical, some of which are life-saving, packages need to be high. The operational life expectancies of some of those devices must be up to 20 years.

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Most Popular Articles according to Xplore® usage statistics

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349           

Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect

Ravi Mahajan Zhiguo Qian Ram S. Viswanath Sriram Srinivasan Kemal Aygün Wei-Lun Jen Sujit Sharan Ashish Dhall

Publication Year: 2019, Page(s): 1952 - 1962

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim Jun So Pak Jonghyun Cho Eakhwan Song Jeonghyeon Cho Heegon Kim Taigon Song Junho Lee ; Hyungdong Lee ; Kunwoo Park Seungtaek Yang Min-Suk Suh Kwang-Yoo Byun Joungho Kim

Publication Year: 2011, Page(s): 181 - 195

Fully Symmetric 3-D Transformers With Through-Silicon via IPD Technology for RF Applications

Sih-Han Li ; Shawn S. H. Hsu ; Kuan-Wei Chen ; Chih-Sheng Lin ; Shang-Chun Chen ; Jie Zhang ; Pei-Jer Tzeng

Publication Year: 2019, Page(s): 2143 - 2151

Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ; Ray T. Chen

Publication Year: 2018, Page(s): 1695 - 1701

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At the November 2019 EPS Board of Governors meeting the Board approved a motion to create a new Program Director position on the EPS Board of Governors. The position will be the Region 1-7 & 9 Program Director and will have the same voting rights and privileges of the Program Directors, per the EPS bylaws. The Program Director for Regions 1-7 and 9 is responsible for the oversight and guidance of the chapters in these regions.  The Region 1-7 and 9 Program Director will also serve as the EPS representative at our flagship conference ECTC.

Note that in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 1.B and in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 2.C: Once approved by the IEEE Vice President, Technical Activities, the proposed amendment shall be publicized to the membership with notice that it goes into effect unless 40 or more Society members object in writing within 30 days. Please use this communication as notification.