Most Popular T-CPMT Articles

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3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349           

Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect

Ravi Mahajan Zhiguo Qian Ram S. Viswanath Sriram Srinivasan Kemal Aygün Wei-Lun Jen Sujit Sharan Ashish Dhall

Publication Year: 2019, Page(s): 1952 - 1962

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim Jun So Pak Jonghyun Cho Eakhwan Song Jeonghyeon Cho Heegon Kim Taigon Song Junho Lee ; Hyungdong Lee ; Kunwoo Park Seungtaek Yang Min-Suk Suh Kwang-Yoo Byun Joungho Kim

Publication Year: 2011, Page(s): 181 - 195

Fully Symmetric 3-D Transformers With Through-Silicon via IPD Technology for RF Applications

Sih-Han Li ; Shawn S. H. Hsu ; Kuan-Wei Chen ; Chih-Sheng Lin ; Shang-Chun Chen ; Jie Zhang ; Pei-Jer Tzeng

Publication Year: 2019, Page(s): 2143 - 2151

Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ; Ray T. Chen

Publication Year: 2018, Page(s): 1695 - 1701

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