3D & Systems Summit


Get the Latest Insights in Emerging Technologies, 3D Packaging, Systems Applications and Future Market Opportunities

IEEE Electronic Packaging Society (EPS) members are eligible for a ten percent discount using promo code: 3DS2020-FAQCw

Start the New Year Off Right: 

Join SEMI Europe at the 3D & Systems Summitfrom January 27 – 29, 2020 in Dresden, Germany!

· The conference will feature the latest insights and developments in 3D integration and systems for semiconductor manufacturing, focusing on high-reliability, high-performance disruptive applications such as mobile and IoT.

 · The exclusive exhibition area will showcase the most prominent names in the industry alongside new and innovative start-up companies and will include business-to-business matchmaking and networking opportunities.

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