Title: The Evolution of Lead-free Solder Alloys
Date: December 16, 2020
Presenter: Dr. HongWen Zhang
Dr. HongWen Zhang is the Manager of the Alloy Group at the Indium Corporation's Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high temperature and high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed powder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint's morphology, thus improving the reliability.