IEEE EPS Thermal and Mechanical Technical Committee

Chair: Dereje Agonafer 

Website: under construction:

The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest include:

  • Electronic Cooling and Thermal Management of Component and System
  • Thermal Design and Analysis
  • Coupled Electro-Thermal Phenomena
  • Thermal and Thermomechanical Measurements
  • Thermal Mismatches and Stressses
  • Temperature Induced Fracture and Moisture Stresses in IC Package
  • Thermomechanical Design and Analysis of Component and System
  • Thermomechanical Computer Aided Design and Engineering
  • Co-Design
  • Heterogeneous Integration

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