Heterogeneous integration and chiplet assembly – all between 2D and 3D

Peter Ramm, Paul Franzon, Phil Garrou, Raja Swaminathan, Pascal Vivet, Mustafa Badaroglu


“Real 3D” integration - 3DIC Integration in its true definition - has a long history. As early as 1985, Richard P. Feynman expressed this vision: “Another direction of improvement of computing power is to make physical machines three dimensional instead of all on a surface of a chip. That can be done in stages instead of all at once - you can have several layers and then add many more layers as time goes on”.

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