Professor Avram Bar-Cohen, past President of IEEE Electronics Packaging Society, and past Editor-in-Chief of the IEEE Transactions on Components and Packaging Technologies passed away on October 10, 2020. He was a giant in the field of thermal management, and made seminal research and professional contributions over a five decade period. Professor Bar-Cohen’s research focused on several areas in microsystems packaging. His work on air cooling focused on optimization of natural and forced air cooling devices, and sustainability and life cycle considerations of thermal management devices. His work spanned the spectrum from fundamental research to emerging applications, including 2.5D and 3D heterogeneous integration, radio frequency, opto-electronics, and power electronics devices and systems.