3D Integration Technologies for Various Quantum Computing Devices

Peng Zhao^1,2, Yu Dian Lim¹ , Hong Yu Li² , Guidoni Luca³ , and Chuan Seng Tan¹,*

¹Nanyang Technological University, Singapore

²A*STAR Institute of Microelectronics, Singapore ³Université de Paris, France

*Email: tancs@ntu.edu.sg

INTRODUCTION

With the slowdown of transistor node scaling in the past decade, advanced three-dimensional (3D) integration technologies have been developed as an alternative approach for the continuity of Moore’s law, specifically in reducing form factor, cost, power and increasing performance. By extending the conventional two-dimensional layouts, assembly, and interconnections into the third dimension, 3D integration has progressively become the primary building block of advanced electronic devices.

By extending the conventionally two-dimensional layouts, assembly, and interconnections into the third dimension, 3D integration has progressively become the primary building block of advanced electronic devices.