2023 IEEE Rao R. Tummala Electronics Packaging Award Recipient
The EPS congratulates Guoqi (Kouchi) Zhang, recipient of the 2023 Rao Tummala Electronics Packaging Award, "for scientific and technological leadership in "More than Moore" (MTM) packaging."
Prof. Zhang made outstanding technical contributions to More than Moore (MtM) packaging, co-designing, and reliability. His technical achievements enabled many key applications including energy saving via LED packaging, IoE via sensor packages, 5G via AiP, and much more. He is one of the persistent leaders of developing co-designing methods that lays down the foundation for designing for reliability, lifetime diagnostics and prognostics, virtual prototyping/qualification, and digital twin of packaging. Zhang developed an accelerated test method for LED systems that substantially reduced testing time. His accelerated test method opened the way to commercialization of LED technology and has been a key technology in reducing global energy consumption. An IEEE Fellow, Zhang is a chair professor at Delft University of Technology, Delft, the Netherlands.
The Rao Tummala Electronics Packaging Award, an IEEE Technical Field Award, sponsored by the EPS and administered by the IEEE Awards Board, is the highest award honoring technical achievement in EPS fields of interest.