IEEE SPI 2023 Call For Papers

Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

In view of previous years success, the Committees are hardworking and keen on the 27th Edition which will be held as an in-person event in Aveiro, Portugal from May 7-10, 2023. The technical program will include both oral and poster sessions, and several prominent experts will be giving keynotes on areas of emerging interest.

The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. All contributions will undergo a rigorous review process, conducted by the TPC. Instructions for manuscript submission are available in the Submissions menu. Full paper submission date is January 23, 2023.

Feel free to look into our website for further information about IEEE SPI 2023, as well as broadcast the workshop in your institution and to your fellow colleagues and students. It is a pleasure to invite you all to the 27th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!

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