IEEE EPS 73rd ECTC – Conference Organizing Meeting

3 – 4th November, Dallas

Dear IEEE 73rd ECTC Attendees,

A group of dedicated industry leaders and top researchers gathered in Dallas and worked over two days to prepare the exciting premier packaging conference in the world: the IEEE Electronic Packaging Society sponsored ECTC 2023. The subcommittees met and created the conference sessions drawing from 618 abstracts received, of which 335 include a first-time ECTC author. We want to thank all authors who submitted their abstracts. Fortunately, we can accommodate the majority of them in our next program; soon, the authors of the selected papers will be notified. Additionally, the executive committee discussed conference details, including the changes to the program. The authors who submitted abstracts this year may have already noticed that we have updated our abstract submission platform. One of the updates is the requirement that the authors provide the novelty of their work and their abstract.

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